Mitsubishi Melsec-L Series User Manual page 5

Communication module
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[Wiring Precautions]
• Shut off the external power supply for the system in all phases before wiring.
Failure to do so may result in electric shock or cause the module to fail or malfunction.
• After installation and wiring, attach the included terminal cover to the product before turning it on
for operation. Failure to do so may result in electric shock.
[Wiring Precautions]
• Use applicable solderless terminals and tighten them within the specified torque range. If any
spade solderless terminal is used, it may be disconnected when a screw on the terminal block
comes loose, resulting in failure.
• Connectors for external device connection must be crimped or pressed with the tool specified by
the manufacturer, or must be correctly soldered.
Incomplete connections could result in short circuit, fire, or malfunction.
• Securely connect the connector to the module.
• Place the cables in a duct or clamp them.
If not, dangling cable may swing or inadvertently be pulled, resulting in damage to the module or
cables or malfunction due to poor contact.
• Check the interface type and correctly connect the cable.
Incorrect wiring (connecting the cable to an incorrect interface) may cause failure of the module
and external device.
• Tighten the terminal block screw within the specified torque range.
Undertightening can cause short circuit, fire, or malfunction. Overtightening can damage the
screw and/or module, resulting in drop, short circuit, fire, or malfunction.
• When disconnecting the cable from the module, do not pull the cable by the cable part.
For the cable with connector, hold the connector by hand and pull it out. For the cable
connected to the terminal block, loosen the terminal block screws.
Failure to do so may result in malfunction and damage to the module or cable.
• Prevent foreign matter such as dust or wire chips from entering the module.
Such foreign matter can cause a fire, failure, or malfunction.
• A protective film is attached to the top of the module to prevent foreign matter, such as wire
chips, from entering the module during wiring. Do not remove the film during wiring. Remove it
for heat dissipation before system operation.
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WARNING
!
CAUTION
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