IEI Technology WAFER-UTL3 User Manual page 133

3.5'' sbc with 6/7 generation intel mobile core i7/i5/i3 or celeron soc, ddr4 so-dimm, triple display, dual gbe, pcie mini, sata 6gb/s, usb 3.0, com,hd audio and rohs
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The details provided in this appendix are to ensure that the product is compliant with the
Peoples Republic of China (China) RoHS standards. The table below acknowledges the
presences of small quantities of certain materials in the product, and is applicable to China
RoHS only.
A label will be placed on each product to indicate the estimated "Environmentally Friendly
Use Period" (EFUP). This is an estimate of the number of years that these substances
would "not leak out or undergo abrupt change." This product may contain replaceable
sub-assemblies/components which have a shorter EFUP such as batteries and lamps.
These components will be separately marked.
Please refer to below table.
Part Name
Toxic or Hazardous Substances and Elements
Lead
(Pb)
Housing
O
Display
O
Printed Circuit
O
Board
Metal Fasteners
O
Cable Assembly
O
Fan Assembly
O
Power Supply
O
Assemblies
Battery
O
O:
This toxic or hazardous substance is contained in all of the homogeneous materials for the part is below the limit
requirement in SJ/T11363-2006 (now replaced by GB/T 26572-2011).
X:
This toxic or hazardous substance is contained in at least one of the homogeneous materials for this part is above
the limit requirement in SJ/T11363-2006 (now replaced by GB/T 26572-2011).
Page 120
Mercury
Cadmium
(Hg)
(Cd)
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
WAFER-ULT3/ULT4 3.5" SBC
Hexavalent
Polybrominated
Chromium
Biphenyls
(CR(VI))
(PBB)
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
Polybrominated
Diphenyl Ethers
(PBDE)
O
O
O
O
O
O
O
O

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