Reflow Soldering - Beta Layout Reflow-Kit V3 PRO Operating Instructions Manual

The oven is now heated to 100 °C. Once it reaches this temperature, the heat is
switched off. The controller now measures how much more the oven will heat despite
the heat being off.
A beep signals the end of the learn process and the display indicates the "Cooling"
phase.
• The oven door can now be opened.
The controller has now calculated and stored the oven's characteristics.
When the oven has cooled to below 50 °C, it is ready for reflow soldering.

7.4 Reflow soldering

The reflow controller works by taking control of the oven. It uses one of 5 possible para-
meter sets for the reflow process.
In this way, you can define parameter sets for different soldering processes. Please se-
lect the required parameter set before starting the soldering process.
Chapter 9, "Setting parameters via the computer", contains further information on how
to change the active parameter set.
The number of the currently selected parameter set is shown on the display.
Ready
The soldering process can only be started when the reflow oven has been heated to
< 50 °C. If you want to solder several boards in quick succession, the oven temperature
must drop to below 50 °C between each soldering operation.
To solder the board, position it in the middle of the grill. Place the temperature sensor
under or over the board in such a way that it makes contact with the board. This en-
sures that the sensor will calculate the board temperature and not the air temperature.
Close the oven door and check again that the temperature sensor has not slipped away
from the board.
Press START to begin the automatic soldering process.
Solder
Soak
2 125C
2 320F
20S
Reflow Controller V3 PRO
Operating Instructions
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