Preparing The Oven - Beta Layout Reflow-Kit V3 PRO Operating Instructions Manual

Please note that the oven must be able to build up to the temperature required for the
soldering process. If the oven capacity is too low, it heats too slowly and this may expo-
se the components to more thermal stress.
Please note the maximum temperature resistance of the sensor.
Note on using fan (convection) ovens:
Fan ovens should not be used because when the heat and fan functions are controlled
simultaneously, the resulting air movement causes 'hot spots' in the oven, which can
lead to significant temperature fluctuations.

7.2. Preparing the oven

Before you start soldering, you must prepare the oven and the temperature sensor.
• Connect the supplied sensor to the reflow controller, taking care to maintain correct
polarity.
• Run the sensor cable into the soldering area of the oven.
• Secure the sensor in such a way that the end of it is as close as possible to the
soldering material.
TIP
Attach the temperature sensor to a segment of board using a wire and place it along-
side the board to be soldered. The board segment should have specifications identical to
the board to be soldered.
The sensor supplied is heat-resistant up to 260 °C (500 °F).
Please ensure that your oven does not exceed the above temperature.
Please ensure also that the sensor cable does not come in contact with oven parts that
may be hotter than 260 °C.
• Connect the mains plug of your reflow oven to the controller socket.
• Switch your reflow oven to the highest heat capacity.
• Switch the upper and lower heat on and slide the grill into the middle of the oven.
• Switch the oven temperature regulator to the highest setting.
• Set the oven timer to > 30 minutes. The oven should not be preheated
Reflow Controller V3 PRO
Operating Instructions
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