Toshiba T90S3S08KS6XSN Manual page 149

TOSHIBA G9000 UPS White Paper
FIGURE 11
A tailored power
module for medium
capacity three-level
uninterruptible power
supplies
An optimized power
module contains
advanced mature
chip technology for
high performance and
reliability.
© 2008 TOSHIBA INTERNATIONAL CORPORATION – INDUSTRIAL DIVISION
/toshiba02/User2/UPSMKT/GENERAL/UPS/3 Phase Systems/White Papers/G9000 White Paper - multi-level converter.doc
Power Module Optimization
In addition to the inherent benefits of the three-level topology, a tailored
design of the power semiconductor modules provides further
improvements in terms of component stress, noise and losses. Figure 11
shows an optimized IGBT power module for a medium capacity three-level
uninterruptible power supply. This optimization provides higher efficiency,
reliability and performance by means of selection of the IGBT chip
technology as well as design of the integrated circuit.
The IGBT chip inside this package features the latest significant advances
in the power semiconductor industry and the proven, reliable record of an
extremely mature technology. As a result, this combination offers great
reduction of power losses, better thermal characteristics and higher
reliability.
To further enhance the features of the chosen IGBT chip, internal circuit
layout and component placement play a leading role in the power module
design. This power module comprises an arm of a three-level converter as
shown in the schematic of Figure 12. Its circuit integration design
decreases parasitic inductances and reduces electromagnetic noise.
Therefore power semiconductors inside this package experience lower
stresses caused by switching surge voltage.
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