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5.3.2
Pressure Specification
To avoid damages to the ASIC (die or solder ball joint cracks) caused by improper mechanical assembly of the cooling
device, follow the recommendations below:
•
It is recommended that the maximum load that is evenly applied across the contact area between the thermal
management device and the die does not exceed 6 lbf. Note that a total load of 4-6 lbf is adequate to secure the
thermal management device and achieve the lowest thermal contact resistance with a temperature drop across
the thermal interface material of no more than 3°C. Also, the surface flatness of the metal spreader should be
0.001 inch/1 inch.
•
Pre-test the assembly fixture with a strain gauge to make sure that the flexing of the final assembled board and
the pressure applying around the ASIC package will not exceed 600 micron strain under any circumstances.
•
Ensure that any distortion (bow or twist) of the board after SMT and cooling device assembly is within industry
45732 AMD 780E Databook 3.10
5-10
Figure 5-2 RS780E Ball Arrangement (Bottom View)
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© 2009 Advanced Micro Devices, Inc.
Proprietary
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