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The case temperature is defined at the geometric top center of the processor. Analysis
indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
Table 5-1
feature is designed to protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained periods of time. For more details on
the usage of this feature, refer to
requirements, systems should be designed to the Flexible Motherboard (FMB)
guidelines, even if a processor with a lower thermal dissipation is currently planned. In
all cases the Thermal Monitor or Thermal Monitor 2 feature must be enabled
for the processor to remain within specification.
Table 5-1.
Processor Thermal Specifications
Core
Processor
Frequency
Number
(GHz)
X3380
3.16
X3370
3.00
X3330
2.66
X3360
2.83
X3350
2.66
X3320
2.50
L3360
2.83
NOTES:
1.
Specification is at 37°C Tc and minimum voltage loadline. Specification is guaranteed by
design characterization and not 100% tested.
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets.
The TDP is not the maximum power that the processor can dissipate.
3.
This table shows the maximum TDP for a given frequency range. Individual processors
may have a lower TDP. Therefore, the maximum T
individual processor. Refer to thermal profile figure and associated table for the allowed
combinations of power and T
4.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting future
thermal requirements.
76
instead of the maximum processor power consumption. The Thermal Monitor
Thermal
Extended
Design
HALT
Power (W)
Power
2, 3
1
(W)
95
12
95
16
95
16
95
12
95
12
95
12
65
12
C
Thermal Specifications and Design Considerations
Section
5.2. To ensure maximum flexibility for future
4
FMB Guidance
775_VR_CONFIG_05A
(95W)
775_VR_CONFIG_05A
(95W)
775_VR_CONFIG_06A
(65 W) [L3360]
will vary depending on the TDP of the
C
.
Minimum
Maximum T
C
T
(°C)
(°C)
C
See
Table 5-2
5
and
Figure 5-1
See
Table 5-2
5
and
Figure 5-1
Datasheet
Notes
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