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Package Mechanical Specifications
4.
These guidelines are based on limited testing for design characterization.
3.1.5
Package Insertion Specifications
The processor can be inserted into and removed from a LGA775 socket 15 times. The
socket should meet the LGA775 requirements detailed in the LGA775 Socket
Mechanical Design Guide.
3.1.6
Processor Mass Specification
The typical mass of the processor is 21.5 g [0.76 oz]. This mass [weight] includes all
the components that are included in the package.
3.1.7
Processor Materials
Table 3-3
Table 3-3.
Processor Materials
Integrated Heat Spreader (IHS)
3.1.8
Processor Markings
Figure 3-5
identification of the processor.
Figure 3-5.
Processor Top-Side Markings Example
Datasheet
lists some of the package components and associated materials.
Component
Substrate
Substrate Lands
shows the topside markings on the processor. This diagram is to aid in the
INTEL
INTEL® XEON®
SLxxx [COO]
2.83GHZ/12M/1333/05A
[FPO]
Nickel Plated Copper
Fiber Reinforced Resin
Gold Plated Copper
©'06 3360
M
e
4
ATPO
S/N
Material
39
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