Thermal Specifications; Boxed Processor Cooling Requirements; Baseboard Power Header Placement Relative To Processor Socket - Intel Quad-Core Xeon 3300 Series Datasheet

Figure 7-6.

Baseboard Power Header Placement Relative to Processor Socket

7.4

Thermal Specifications

This section describes the cooling requirements of the fan heatsink solution utilized by
the boxed processor.
7.4.1

Boxed Processor Cooling Requirements

The boxed processor may be directly cooled with a fan heatsink. However, meeting the
processor's temperature specification is also a function of the thermal design of the
entire system, and ultimately the responsibility of the system integrator. The processor
temperature specification is found in
fan heatsink is able to keep the processor temperature within the specifications (see
Table 5-1) in chassis that provide good thermal management. For the boxed processor
fan heatsink to operate properly, it is critical that the airflow provided to the fan
heatsink is unimpeded. Airflow of the fan heatsink is into the center and out of the
sides of the fan heatsink. Airspace is required around the fan to ensure that the airflow
through the fan heatsink is not blocked. Blocking the airflow to the fan heatsink
reduces the cooling efficiency and decreases fan life.
illustrate an acceptable airspace clearance for the fan heatsink. The air temperature
entering the fan should be kept below 38 ºC. Again, meeting the processor's
temperature specification is the responsibility of the system integrator.
96
B
C
R110
[4.33]
Boxed_Proc_PwrHeaderPlacement
Chapter 5 of this document. The boxed processor
Figure 7-7
Boxed Processor Specifications
and Figure 7-8
Datasheet