25.5 Mm Tall Heatsink; Performance Expectations For 25.5 Mm Tall Heatsink - Intel Xeon 5500 Series Design Manual

Thermal Solutions
5.1.1

25.5 mm Tall Heatsink

For the 25.5 mm tall heatsink,
expectations. These values are not used to generate processor thermal specifications.
Table 5-2.

Performance Expectations for 25.5 mm Tall Heatsink

Parameter
Altitude, system
ambient temp
TDP
1
T
LA
Ψ 2
CA
3
Airflow
System height
(form factor)
Heatsink
volumetric
Heatsink
technology
Notes:
1. Local ambient temperature of the air entering the heatsink.
2. Max target (mean + 3 sigma + offset) for thermal characterization parameter
3. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches H
4. Reference system configuration. Processor is downstream from memory in SSI blade and EEB (Entry-Level
Electronics Bay), not in TEB (Thin Electronics Bay). Ducting is utilized to direct airflow.
5. Dimensions of heatsink do not include socket or processor. The 25.5 mm heatsink height + socket/processor
height (7.729 mm,
(http://ssiforum.oaktree.com/).
6. Passive heatsinks. Dow Corning TC-1996 thermal interface material.
Thermal/Mechanical Design Guide
Table 5-2
o
50 C
o
0.287 C/W
13.3 CFM @ 0.334" dP
SSI blade
4
6
Table 4-2) complies with 33.5mm max height for SSI blade boards
provides guidance regarding performance
Value
o
Sea level, 35 C
95W, Profile B
o
49 C
o
0.337 C/W
10 CFM @ 0.210" dP 16 CFM @ 0.354" dP
1U (EEB)
5
90 x 90 x 25.5mm (1U)
Cu base, Al fins
o
40 C
o
0.275 C/W
1U (TEB)
(Section 5.5.1).
O.
2
33