E Embedded Thermal Solutions; Performance Targets; E.1 Performance Targets; Boundary Conditions And Performance Targets - Intel Xeon 5500 Series Design Manual

Embedded Thermal Solutions
E Embedded Thermal Solutions
This section describes the LV processors and Embedded reference heatsinks for NEBS
(Network Equipment Building Systems) compliant ATCA (Advanced Telecommunications
Computing Architecture) systems. These LV processors are good for any form factor
that needs to meet NEBS requirements.
E.1

Performance Targets

Table E-1
heatsinks. These values are used to generate processor thermal specifications and to
provide guidance for heatsink design.
Table E-1.

Boundary Conditions and Performance Targets

Altitude, system ambient temp
Nominal/Short-term
TDP
1,4
T
LA
Ψ
2
CA
System height (form factor)
Heatsink volumetric
Heatsink technology
Notes:
1. Local ambient temperature of the air entering the heatsink.
2. Max target (mean + 3 sigma + offset) for thermal characterization parameter
3. Reference system configuration. In a single wide ATCA blade the 60 W processor should be used in single
socket only and the 38 W processor can be used in dual socket.
4. Local Ambient Temperature written 50/65
Short-Term NEBS excursions.
5. Passive heatsinks with TIM.
6. See Section 5.1
Thermal/Mechanical Design Guide
provides boundary conditions and performance targets for 1U and ATCA
Parameter
Sea level, 40
60 W
51.9/66.9
0.302
3
1U (EEB) or ATCA
1U (90 x 90 x 27) or Custom ATCA
(90 x 90 x 13mm + heat
exchanger)
5
for standard 1U solutions that do not need to meet NEBS.
Value
o
C/55C
o
C
o
C/W
Cu base, Cu fins
o o
C means 50 C under Nominal conditions but 65
Value
o
Sea level, 40 C/55C
38 W
o
50/65 C
o
0.532 C/W
ATCA
ATCA (90 x 90 x 13 mm)
(Section 5.5.1).
o
C is allowed for
87