Mm Tall Heatsink; Best-Fit Equations; Performance Expectations For Intel Xeon Processor 5500 Series With 25.5 Mm Tall Heatsink - Intel X5550 - Quad Core Xeon Design Manual

3. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches H
4. Reference system configuration. Processor is downstream from memory in EEB (Entry-Level Electronics Bay).
Ducting is utilized to direct airflow.
5. The 1U heatsink can also meet Profile B for the 95W processor in TEB (Thin Electronics Bay) under the
following conditions: TLA = 40ºC,
not used to generate processor thermal specifications). Processor is not downstream from memory in TEB.
Ducting is utilized to direct airflow.
6. Dimensions of heatsink do not include socket or processor.
7. The 2U heatsink height (64mm) + socket/processor height (7.729 mm,
max height for EEB monoplanar boards (http://ssiforum.org/).
8. Passive heatsinks. PCM45F thermal interface material.
9. WS = Workstation.
Table 5-1
determine
Figure 5-1. Heatsink detailed drawings are in Appendix B.
Figure 5-1.

Best-fit Equations

5.1.1

25.5 mm Tall Heatsink

For the 25.5 mm tall heatsink,
expectations. These values are not used to generate processor thermal specifications.
Table 5-3. Performance Expectations for Intel Xeon Processor 5500 Series with 25.5 mm
Tall Heatsink
Parameter
Altitude, system
ambient temp
TDP
1
T
LA
2
CA
3
Airflow
System height
(form factor)
Heatsink
volumetric
Heatsink
technology
Notes:
1. Local ambient temperature of the air entering the heatsink.
2. Max target (mean + 3 sigma + offset) for thermal characterization parameter
3. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches H
4. Reference system configuration. Processor is downstream from memory in SSI blade and EEB (Entry-Level
Electronics Bay), not in TEB (Thin Electronics Bay). Ducting is utilized to direct airflow.
32
CA = 0.275ºC/W, airflow = 16 CFM @ 0.344" dP (these TEB values are
and Table 5-2 specify
and pressure drop targets for other airflows, use Best-fit equations in
CA
Table 5-3
o
50 C
o
0.296 C/W
13.3 CFM @ 0.329" dP
SSI blade
4
6
and pressure drop targets for specific airflows. To
CA
provides guidance regarding performance
Value
o
Sea level, 35 C
95W, Profile B
o
49 C
o
0.333 C/W
10 CFM @ 0.239" dP
1U (EEB)
5
90 x 90 x 25.5mm (1U)
Cu base, Al fins
Thermal Solutions
Table 4-2) complies with 76.2 mm
o
40 C
o
0.278 C/W
16 CFM @ 0.406" dP
1U (TEB)
(Section 5.5.1).
Thermal/Mechanical Design Guide
O.
2
O.
2