Extruded Heatsink Profiles; Figure 12. Extruded Heatsink Profile; Figure 13. Alternate Tall Heatsink Profile - Intel E7500 Thermal Design Manual

Chipset memory controller hub (mch) thermal and mechanical design guidelines
Hide thumbs Also See for E7500:
Table of Contents

Advertisement

Reference Thermal Solutions
6.3.2

Extruded Heatsink Profiles

The reference thermal solution uses an extruded heatsink for cooling the E7500/E7505 chipset
MCH components. Figure 12 shows the heatsink profile. This document does not provide
tolerance information. Check with your heatsink supplier for specific tolerances. Appendix A lists
suppliers for the extruded heatsink. Other heatsinks with similar dimensions and increased thermal
performance may be available, including the tall heatsink shown in Figure 13. Contact your
heatsink supplier for information on alternate heatsinks.

Figure 12. Extruded Heatsink Profile

3.05 mm (0.120 in.)
NOTE: Not to scale.

Figure 13. Alternate Tall Heatsink Profile

3.81 mm (0.150 in.)
NOTE: Not to scale.
26
42.34 mm (1.67 in.)
42.34 mm (1.67 in.)
®
Intel
E7500/E7505 Chipset MCH Thermal Design Guide
23.01 mm (0.906 in.)
Extr_Heasink_Profile
35.00 mm (1.38 in.)
Alt_Extr_Heatsink_Profile
R

Advertisement

Table of Contents
loading

This manual is also suitable for:

E7505

Table of Contents