Heat Pipe Considerations; Ttv Die Size And Orientation - Intel Xeon 5500 Series Design Manual

5.2

Heat Pipe Considerations

Figure 5-2
positioned similarly to the processor die.
Figure 5-2.

TTV Die Size and Orientation

Die CL
Package CL
34
shows the orientation and position of the TTV die. The TTV die is sized and
Figure 1 - Side Views of Package with IHS (not to scale)
1.0
45
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Core
19.3
NOT TO SCALE
All Dimensions in mm
Thermal Solutions
Thermal/Mechanical Design Guide