Introduction; Platform Lga2011-0 Socket Stack With Tall-Heat Pipe Heatsink - Intel BX80619I73820 Design Manual

Introduction

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Introduction
This document provides guidelines for the design of thermal and mechanical solutions
for 1-socket High End Desktop (HEDT) processor platforms. The processors covered are
listed in the Intel
Volume 1 (see
• 2nd Generation Intel
— Intel
— Intel
— Intel
— Intel
The components described in this document include:
• The processor thermal solution (heatsink) and associated retention hardware.
• The LGA2011-0 socket, the Independent Loading Mechanism (ILM) and back plate.
Figure 1-1.

Platform LGA2011-0 Socket Stack with Tall-Heat Pipe Heatsink

The goals of this document are:
• To assist board and system thermal mechanical designers.
• To assist designers and suppliers of processor heatsinks.
Thermal/Mechanical Specifications and Design Guide
®
Core™ i7 Processor Family for the LGA-2011 Socket Datasheet,
Table 1-1) and include the following:
® Core ™ i7 Processor Family
®
Core™ i7-3970X processor Extreme Edition
® Core™ i7-3960X processor Extreme Edition
®
Core™ i7-3930K processor
®
Core™ i7-3820 processor
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