Intel Xeon 5500 Series Design Manual page 6

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Tables
1-1 Reference Documents ...............................................................................................10
1-2 Terms and Descriptions .............................................................................................10
4-1 Socket Component Mass............................................................................................27
4-2 1366-land Package and LGA1366 Socket Stackup Height ...............................................27
4-3 Socket and ILM Mechanical Specifications ....................................................................28
4-4 Electrical Requirements for LGA1366 Socket ................................................................29
5-1 Boundary Conditions and Performance Targets .............................................................31
5-2 Performance Expectations for 25.5 mm Tall Heatsink.....................................................33
5-3 Fan Speed Control, TCONTROL and DTS Relationship ....................................................39
5-4 T
Guidance ...................................................................................................39
6-1 Heatsink Test Conditions and Qualification Criteria ........................................................43
A-1 Suppliers for the Intel Reference Thermal Solution ........................................................47
A-2 Suppliers for the Intel Collaboration Thermal Solution ...................................................48
A-3 Suppliers for the Alternative Thermal Solution ..............................................................48
A-4 LGA1366 Socket and ILM Components ........................................................................49
B-1 Mechanical Drawing List ............................................................................................51
C-1 Mechanical Drawing List ............................................................................................79
E-1 Boundary Conditions and Performance Targets .............................................................87
E-2 Embedded Heatsink Component Suppliers ...................................................................92
E-3 Mechanical Drawings List ...........................................................................................92
6
Thermal/Mechanical Design Guide

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