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2.4
Package Installation / Removal
As indicated in
removal of the package.
To assist in package orientation and alignment with the socket:
• The package Pin1 triangle and the socket Pin1 chamfer provide visual reference for
proper orientation.
• The package substrate has orientation notches along two opposing edges of the
package, offset from the centerline. The socket has two corresponding orientation
posts to physically prevent mis-orientation of the package. These orientation
features also provide initial rough alignment of package to socket.
• The socket has alignment walls at the four corners to provide final alignment of the
package.
See
Appendix F
assistance during processor installation and removal.
.
Figure 2-6.
Package Installation / Removal Features
2.4.1
Socket Standoffs and Package Seating Plane
Standoffs on the bottom of the socket base establish the minimum socket height after
solder reflow and are specified in
Similarly, a seating plane on the topside of the socket establishes the minimum
package height. See
18
Figure
2-6, access is provided to facilitate manual installation and
for information regarding a tool designed to provide mechanical
Pin1 triangle
Pin1 triangle
access
access
orientation
orientation
post
post
Pin1 chamfer
Pin1 chamfer
Appendix
Section 4.2
for the calculated IHS height above the motherboard.
orientation
orientation
notch
notch
alignment
alignment
walls
walls
C.
Thermal/Mechanical Design Guide
LGA1366 Socket
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