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Figure 5-5.
Dual Thermal Profile
T
_MAX_B
CASE
T
_MAX_A
CASE
Compliance to Profile A ensures that no measurable performance loss will occur due to
TCC activation. It is expected that TCC would only be activated for very brief periods of
time when running a worst-case real world application in a worst-case thermal
condition. A worst-case real world application is a commercially available, useful
application which dissipates power above TDP for a thermally relevant timeframe. One
example of a worst-case thermal condition is when the processor local ambient
temperature is above the y-axis intercept for Profile A.
5.6
Thermal Features
More information regarding processor thermal features is contained in the appropriate
Datasheet.
38
1U Heatsink
40C
0W
2U Heatsink
POWER
Thermal/Mechanical Design Guide
Thermal Solutions
TDP
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