Lga1366 Socket; Lga1366 Socket With Pick And Place Cover Removed - Intel Xeon 5500 Series Design Manual

LGA1366 Socket

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LGA1366 Socket
This chapter describes a surface mount, LGA (Land Grid Array) socket intended for
processors in the Intel® Xeon® 5500 Platform. The socket provides I/O, power and
ground contacts. The socket contains 1366 contacts arrayed about a cavity in the
center of the socket with lead-free solder balls for surface mounting on the
motherboard.
The socket has 1366 contacts with 1.016 mm X 1.016 mm pitch (X by Y) in a
43x41 grid array with 21x17 grid depopulation in the center of the array and selective
depopulation elsewhere.
The socket must be compatible with the package (processor) and the Independent
Loading Mechanism (ILM). The design includes a back plate which is integral to having
a uniform load on the socket solder joints. Socket loading specifications are listed in
Chapter
Figure 2-1.

LGA1366 Socket with Pick and Place Cover Removed

Thermal/Mechanical Design Guide
4.
package package socket socket
cavity cavity
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