Package Dimensions (Fc-Pga2 Package); Processor Case Loading Parameters (Fc-Pga2 Package) - Intel CELERON 1.10 GHZ Datasheet

Table 53. Package Dimensions (FC-PGA2 Package)
Symbol
A1
A2
B1
B2
C1
C2
D
D1
G1
G2
G3
H
L
P
Pin TP
NOTE: Capacitors will be placed on the pin-side of the FC-PGA2 package in the area defined by G1, G2, and
G3. This area is a keepout zone for motherboard designers.
For Table
1. It is not recommended to use any portion of the processor substrate as a mechanical reference
or load bearing surface for thermal solutions.
2. Parameters assume uniformly applied loads.
Table 54. Processor Case Loading Parameters (FC-PGA2 Package)
Parameter
IHS Surface
IHS Edge
IHS Corner
NOTES:
1. This specification applies to a uniform and a non-uniform load.
2. This is the maximum static force that can be applied by the heatsink and clip to maintain the heatsink and
processor interface.
3. See socket manufacturer's force loading specification also to ensure compliance. Maximum static loading
listed here does not account for the maximum reaction forces on the socket tabs or pins.
Datasheet
Millimeters
Minimum Maximum
2.266 2.690
0.980 1.180
30.800 31.200
30.800 31.200
33.000 max
33.000 max
49.428 49.632
45.466 45.974
0.000 17.780
0.000 17.780
0.000 0.889
2.540
3.048 3.302
0.431 0.483
0.508 Diametric True Position (Pin-to-Pin)
52, the following apply:
Dynamic (max)
200
125
75
® ®
Intel Celeron
Notes Minimum
0.089
0.038
1.212
1.212
1.299 max
1.299 max
1.946
1.790
0.000
0.000
0.000
Nominal
0.120
0.017
0.020 Diametric True Position (Pin-to-Pin)
1 2,3
Static (max) Unit
100 lbf
N/A lbf
N/A ibf
Processor up to 1.10 GHz
Inches
Maximum Notes
0.106
0.047
1.229
1.229
1.954
1.810
0.700
0.700
0.035
0.100 Nominal
0.130
0.019
95