Related Manuals for Intel CORE 2 DUO MOBILE - THERMAL DESIGN GUIDE 6-2008
Summary of Contents for Intel CORE 2 DUO MOBILE - THERMAL DESIGN GUIDE 6-2008
-
Page 1: Embedded Applications
Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications Thermal Design Guide June 2008 Order Number: 320028-001... - Page 2 Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel may make changes to specifications and product descriptions at any time, without notice.
-
Page 3: Table Of Contents
Local Ambient Temperature Measurement Guidelines..........24 7.4.1 Active Heatsink Measurements ..............25 7.4.2 Passive Heatsink Measurements..............25 Reliability Guidelines ....................28 Thermal Solution Component Suppliers..............29 Mechanical Drawings ....................30 Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide June 2008 Order Number: 320028-001... - Page 4 Core™2 Duo processor.......... 10 Required Heatsink Thermal Performance (Ψ ) ............. 17 Reliability Requirements.................... 28 Reference Heatsink ....................29 Mechanical Drawings ....................30 Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications June 2008 Order Number: 320028-001...
-
Page 5: Revision History
Core™ 2 Duo Mobile Processors—Tables Revision History Date Revision Description June 2008 First Public release. Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide June 2008 Order Number: 320028-001... -
Page 6: Introduction
This document describes thermal design guidelines for the Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications in the micro Flip Chip Pin Grid Array (micro-FCPGA) package and the micro Flip Chip Ball Grid Array (micro-FCBGA) package. -
Page 7: Definition Of Terms
Volumetric airflow rate in cubic feet per minute Inches Airflow velocity in linear feet per minute Printed circuit board Heatsink temperature measured on the underside of the heatsink base. SINK Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide June 2008 Order Number: 320028-001... -
Page 8: Reference Documents
Thermal Design Tool Availability Intel provides thermal simulation models of the device and a thermal model user’s guide to aid system designers in simulating, analyzing, and optimizing thermal solutions in an integrated, system- level environment. The models are for use with commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tools including Flotherm* (version 7.1 or higher) by Flomerics, Inc. -
Page 9: Package Information
Core™ 2 Duo Mobile Processors—Package Information Package Information The Intel® Core™2 Duo Processor (XE and SV) is available in 478-pin Micro-FCPGA packages as well as 479-ball Micro-FCBGA packages. The Intel® Core™2 Duo Processor SFF processor (LV and ULV) is available in 956-ball Micro-FCBGA packages. The package mechanical dimensions can be found in the product’s datasheet. -
Page 10: Thermal Specifications
2. Heat transfer through the micro- FCBGA, micro-FCPGA package and socket via the base board is negligible. The cooling capacity without a thermal solution is also minimal, so Intel requires the use of a heatsink for all usage conditions. Maximum Allowed Component Temperature... -
Page 11: Mechanical Specifications
Components placed between the underside of the heatsink and motherboard cannot exceed 4.75 mm in height when using heatsinks that extend beyond the socket envelope shown in Figure 2 for the micro-FCPGA package. Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide June 2008 Order Number: 320028-001... -
Page 12: Primary Side Keep Out Zone Requirements- Micro-Fcpga
Mechanical Specifications—Core™ 2 Duo Mobile Processors Figure 2. Primary Side Keep Out Zone Requirements— Micro-FCPGA Notes: Dimension in millimeters [inches]. Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications June 2008 Order Number: 320028-001... -
Page 13: Primary Side Keep Out Zone Requirements- Micro-Fcbga
Core™ 2 Duo Mobile Processors—Mechanical Specifications Figure 3. Primary Side Keep Out Zone Requirements— Micro-FCBGA Notes: Dimension in millimeters [inches]. Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide June 2008 Order Number: 320028-001... -
Page 14: Secondary Side Keep Out Zone Requirements
Mechanical Specifications—Core™ 2 Duo Mobile Processors Figure 4. Secondary Side Keep Out Zone Requirements Notes: Dimension in millimeters [inches]. Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications June 2008 Order Number: 320028-001... -
Page 15: Thermal Solution Requirements
Figure 5 illustrates the combination of the different thermal characterization parameters. Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide June 2008 Order Number: 320028-001... -
Page 16: Calculating The Required Thermal Performance For The Intel Core™2 Duo Processor
≤ 0.50 °C/W, solving from Equation 2, the performance of the heatsink required is: Equation 4. Required Performance of the Heatsink Ψ Ψ − Ψ − Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications June 2008 Order Number: 320028-001... -
Page 17: Required Heatsink Thermal Performance
Table 3 summarizes the thermal budget required to adequately cool the Intel® Core™ 2 Duo Mobile Processors on 45-nm process. Since the data is based on air data at sea level, a correction factor would be required to estimate the thermal performance at other altitudes. -
Page 18: Reference Thermal Solutions
Reference Thermal Solutions—Core™ 2 Duo Mobile Processors Reference Thermal Solutions Intel has developed reference thermal solutions designed to meet the cooling needs of embedded form factor applications. This chapter describes the overall requirements for the reference thermal solution including critical-to-function dimensions, operating environment, and verification criteria. -
Page 19: Keep Out Zone Requirements
27 mm. The heatsink uses the fastener assembly (refer to Section 6.6) to mount to the PCB. Detailed drawings of this heatsink are provided in Appendix B, “Mechanical Drawings”. Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide June 2008 Order Number: 320028-001... -
Page 20: Keep Out Zone Requirements
10 CFM. If the external ambient is 55 °C, this heatsink will be suitable if the air flow rate is approximately 12 CFM or greater. Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications June 2008... -
Page 21: Compact Pci Reference Heatsink
6.6) to mount to the PCB. Detailed drawings of this heatsink are provided in Appendix B, “Mechanical Drawings”. Figure 10. CompactPCI Reference Heatsink Assembly Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide June 2008 Order Number: 320028-001... -
Page 22: Keep Out Zone Requirements
To ensure proper and consistent thermal performance, the TIM and application process must be properly designed. Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications June 2008 Order Number: 320028-001... -
Page 23: Heatsink Orientation
PCB in an orientation so the heatsink fins will be parallel to the airflow. Figure 12 illustrates this orientation. Figure 12. Heatsink Orientation Relative to Airflow Direction Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide June 2008 Order Number: 320028-001... -
Page 24: Thermal Metrology
(TTV). The TTV allows for an accurate junction temperature measurement as well as input power control. For more information, contact your Intel field sales representative. In addition, the processor’s heatsink should be verified in a system environment. Intel has established guidelines for techniques to measure the component temperature. -
Page 25: Active Heatsink Measurements
The height above the board may vary depending on the height of the thermal solution and form factor. Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide June 2008 Order Number: 320028-001... -
Page 26: Measuring Tla With An Active Heatsink
Thermal Metrology—Core™ 2 Duo Mobile Processors Figure 13. Measuring T with an Active Heatsink Note: Drawing not to scale. Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications June 2008 Order Number: 320028-001... -
Page 27: Measuring Tla With A Passive Heatsink
Core™ 2 Duo Mobile Processors—Thermal Metrology Figure 14. Measuring T with a Passive Heatsink Note: Drawing not to scale. Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide June 2008 Order Number: 320028-001... -
Page 28: Reliability Guidelines
The above tests should be performed on a sample size of at least 12 assemblies from three lots of material. Additional pass/fail criteria may be added at the discretion of the user. Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications June 2008 Order Number: 320028-001... -
Page 29: Thermal Solution Component Suppliers
Core™ 2 Duo Mobile Processors—Thermal Solution Component Suppliers Appendix A Thermal Solution Component Suppliers These vendors and devices are listed by Intel as a convenience to Intel’s general customer base. Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. -
Page 30: Mechanical Drawings
1U Reference Heatsink PCB Keep Out Requirements (Sheet 2 of 2) Figure 24 1U Reference Heatsink Assembly Figure 25 1U Reference Heatsink Figure 26 Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications June 2008 Order Number: 320028-001... -
Page 31: Advancedtca* Reference Heatsink Pcb Keep Out Zone Requirements (Sheet 1 Of 2)
Core™ 2 Duo Mobile Processors—Mechanical Drawings Figure 15. AdvancedTCA* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 1 of 2) Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide June 2008 Order Number: 320028-001... - Page 32 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 16. AdvancedTCA* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 2 of 2) Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications June 2008 Order Number: 320028-001...
-
Page 33: Advancedtca* Reference Heatsink
Core™ 2 Duo Mobile Processors—Mechanical Drawings Figure 17. AdvancedTCA* Reference Heatsink Assembly Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide June 2008 Order Number: 320028-001... -
Page 34: Advancedtca* Reference Heatsink
Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 18. AdvancedTCA* Reference Heatsink Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications June 2008 Order Number: 320028-001... -
Page 35: Compactpci* Reference Heatsink Pcb Keep Out Zone Requirements (Sheet 1 Of 2)
Core™ 2 Duo Mobile Processors—Mechanical Drawings Figure 19. CompactPCI* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 1 of 2) Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide June 2008 Order Number: 320028-001... - Page 36 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 20. CompactPCI* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 2 of 2) Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications June 2008 Order Number: 320028-001...
-
Page 37: Compactpci* Reference Heatsink
Core™ 2 Duo Mobile Processors—Mechanical Drawings Figure 21. CompactPCI* Reference Heatsink Assembly Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide June 2008 Order Number: 320028-001... -
Page 38: Compactpci* Reference Heatsink
Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 22. CompactPCI* Reference Heatsink Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications June 2008 Order Number: 320028-001... -
Page 39: U Reference Heatsink Pcb Keep Out Requirements (Sheet 1 Of 2)
Core™ 2 Duo Mobile Processors—Mechanical Drawings Figure 23. 1U Reference Heatsink PCB Keep Out Requirements (Sheet 1 of 2) Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide June 2008 Order Number: 320028-001... -
Page 40: U Reference Heatsink Pcb Keep Out Requirements (Sheet 2 Of 2)
Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 24. 1U Reference Heatsink PCB Keep Out Requirements (Sheet 2 of 2) Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications June 2008 Order Number: 320028-001... -
Page 41: U Reference Heatsink Assembly
Core™ 2 Duo Mobile Processors—Mechanical Drawings Figure 25. 1U Reference Heatsink Assembly Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide June 2008 Order Number: 320028-001... -
Page 42: U Reference Heatsink
Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 26. 1U Reference Heatsink Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications June 2008 Order Number: 320028-001...