Package Dimensions (Fc-Pga Package); Processor Die Loading Parameters (Fc-Pga Package) - Intel CELERON 1.10 GHZ Datasheet

Table 51. Package Dimensions (FC-PGA Package)
Symbol
A1
A2
B1
B2
C1
C2
D
D1
G1
G2
G3
H
L
P
Pin TP
NOTES:
1. Capacitors and resistors may be placed on the pin-side of the FC-PGA package in the area defined by G1,
G2, and G3. This area is a keepout zone for motherboard designers.
The bare processor die has mechanical load limits that should not be exceeded during heatsink
assembly, mechanical stress testing, or standard drop and shipping conditions. The heatsink attach
solution must not induce permanent stress into the processor substrate with the exception of a
uniform load to maintain the heatsink to the processor thermal interface. The package dynamic and
static loading parameters are listed in
For Table
1. It is not recommended to use any portion of the processor substrate as a mechanical reference
or load bearing surface for thermal solutions.
2. Parameters assume uniformly applied loads
Table 52. Processor Die Loading Parameters (FC-PGA Package)
Parameter
Silicon Die Surface
Silicon Die Edge
NOTES:
1. This specification applies to a uniform and a non-uniform load.
2. This is the maximum static force that can be applied by the heatsink and clip to maintain the heatsink and
processor interface.
Datasheet
Millimeters
Min Max
0.787 0.889
1.000 1.200
11.183 11.285
9.225 9.327
23.495 max
21.590 max
49.428 49.632
45.466 45.947
0.000 17.780
0.000 17.780
0.000 0.889
2.540
3.048 3.302
0.431 0.483
0.508 Diametric True Position (Pin-to-Pin)
52, the following apply:
Dynamic (max)
200
100
®
Intel Celeron
Notes Min
0.031
0.039
0.440
0.363
1.946
1.790
1 0.000
1 0.000
1 0.000
Nominal
0.120
0.017
0.020 Diametric True Position (Pin-to-Pin)
Table 52.
1 2
Static (max)
50
12
®
Processor up to 1.10 GHz
Inches
Max Notes
0.035
0.047
0.445
0.368
0.925 max
0.850 max
1.954
1.810
0.700
0.700
0.035
0.100 Nominal
0.130
0.019
Unit
lbf
lbf
93