Related Manuals for Intel Celeron D
Summary of Contents for Intel Celeron D
- Page 1 ® ® Intel Celeron D Processor in the 775-Land LGA Package for Embedded Applications Thermal Design Guide July 2005 Order #303730-002...
- Page 2 Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel may make changes to specifications and product descriptions at any time, without notice.
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Page 3: Table Of Contents
On-Demand Mode ....................25 4.2.5 System Considerations ..................26 4.2.6 Operating System and Application Software Considerations ........ 26 4.2.7 On-Die Thermal Diode ................... 26 ® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide 303730 Order #... - Page 4 On-Die Thermal Diode Less than TCONTROL........29 4.2.9.2 On-Die Thermal Diode Greater than TCONTROL ......... 29 Acoustic Fan Speed Control ....................29 Intel Enabled Thermal Solutions....................30 Thermal Solution Requirements ..................30 ATX Form Factor ........................ 31 1U Form Factor........................31 2U Form Factor........................
- Page 5 Enabled Thermal Solutions......................31 Board Deflection Configuration Definitions ................. 38 Typical Test Equipment ......................44 Definitions ........................... 47 Supporting Test Equipment ......................47 10 Mechanical Drawings........................58 11 Intel Reference Component Thermal Solution Provider ............. 64 Revision History Date Revision Description July 2005 Updated Table 1 and Table 4.
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Page 6: Introduction
Intel Celeron Processor in the 775-Land LGA Package for Embedded Applications. The specifications for this processor (also referred to herein as the Intel Celeron D Processor in the 775-Land LGA Package) ® ®... -
Page 7: References
® Intel Celeron D Processors 3xx Sequence Datasheet on 90nm Process Intel document #304092 in 775-Land Package Intel® Pentium® 4 Processor 570/571, 560/561, 550/551, 540/541, 530/531 Intel document # 302351 and 520/521 Supporting Hyper-Threading Technology Datasheet ® ® Intel Pentium... - Page 8 FMB1 and FMB2 are sequential estimates of processor specifications over time. A feature on the Intel Celeron D Processor in the 775-Land LGA Package that attempts Thermal Monitor to keep the processor’s die temperature within factory specifications.
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Page 9: Processor Thermal/Mechanical Information
2.1.1 Processor Package The Celeron D Processor in the 775-Land LGA Package is packaged in a Flip-Chip Land Grid Array (FC-LGA4) package that interfaces with the motherboard via a LGA775 socket. Please refer to the processor datasheet for detailed mechanical specifications. -
Page 10: Heatsink Attach
TIMs such as thermal greases are not as sensitive to applied pressure. Designs should consider a possible decrease in applied pressure over time due to potential structural relaxation in retention components. ® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide Order #303730... -
Page 11: Heatsink Clip Load Requirement
2.1.2.3 Additional Guidelines In addition to the general guidelines given above, the heatsink attach mechanism for the Celeron D processor in the 775-land LGA package should be designed to the following guidelines: • Holds the heatsink in place under mechanical shock and vibration events and applies force to the heatsink base to maintain desired pressure on the thermal interface material. -
Page 12: Processor Case Temperature And Power Dissipation
Processor Thermal/Mechanical Information Intel has introduced a new method for specifying the thermal limits for the Celeron D Processor in the 775-Land LGA Package. The new parameters are the Thermal Profile and T . The CONTROL Thermal Profile defines the maximum case temperature as a function of power being dissipated. -
Page 13: Control
61 °C. Contact your Intel sales representative for assistance in processor power measurement. For the Intel Celeron D Processor in the 775-Land LGA Package, there are two thermal profiles to consider. The Platform Requirement Bit (PRB) indicates which thermal profile is appropriate for a specific processor. -
Page 14: Heatsink Design Considerations
This is achieved in part by using the vs. RPM and RPM vs. Acoustics (dBA) performance curves from the Intel enabled thermal solution. A thermal solution designed to meet the thermal profile should perform virtually the same for any value of T . -
Page 15: Heatsink Size
The recommended maximum heatsink weight for the Celeron D processor in the 775-land LGA package is 450g for the ATX form factor. This weight includes the fan and the heatsink only. The attach mechanism (clip, fasteners, etc.) is not included. -
Page 16: Thermal Interface Material
Processor Thermal/Mechanical Information Intel recommends testing and validating heatsink performance in full mechanical enabling configuration to capture any impact of IHS flatness change due to combined socket and heatsink loading. While socket loading alone may increase the IHS warpage, the heatsink preload redistributes the load on the package and improves the resulting IHS flatness in the enabled state. - Page 17 To ease the burden on thermal solutions, the Thermal Monitor feature and associated logic have been integrated into the silicon of the Celeron D Processor in the 775-land LGA package. By taking advantage of the Thermal Monitor feature, system designers may reduce thermal solution cost by designing to TDP instead of maximum power.
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Page 18: Thermal Metrology
= Thermal characterization parameter from heatsink-to-local ambient (°C/W) Ψ is strongly dependent on the thermal conductivity and thickness of the TIM between the heatsink and IHS. ® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide Order #303730... -
Page 19: Example
The following provides an illustration of how one might determine the appropriate performance targets. The example power and temperature numbers used here are not related to any Intel processor thermal specifications, and are for illustrative purposes only. -
Page 20: Processor Thermal Solution Performance Assessment
Thermal performance of a heatsink should be assessed using a thermal test vehicle (TTV) provided by Intel. The TTV is a well-characterized thermal tool, whereas real processors can introduce additional factors that can impact test results. In particular, the power level from actual processors varies significantly, even when running the maximum power application provided by Intel, due to variances in the manufacturing process. -
Page 21: Measuring Passive Heatsinks
This placement guideline is meant to minimize the effect of localized hot spots from baseboard components. ® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide21 303730... -
Page 22: Processor Case Temperature Measurement Guidelines
NOTE: Dimensions in drawing not to scale. Processor Case Temperature Measurement Guidelines To ensure functionality and reliability, the Celeron D Processor in the 775-land LGA package is specified for proper operation when T is maintained at or below the thermal profile as listed in the processor datasheet. -
Page 23: Thermal Management Logic And Thermal Monitor
The Thermal Monitor can reduce cooling solution cost, by allowing thermal designs to target TDP. Thermal Monitor Implementation On the Celeron D processor in the 775-land LGA package, the Thermal Monitor is integrated into the processor silicon. The Thermal Monitor includes: •... -
Page 24: Thermal Control Circuit
Thermal Monitor behavior. Figure 7. Concept for Clocks under Thermal Monitor Control PROCHOT# Normal clock Internal clock Duty cycle control Resultant internal clock ® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide Order #303730... -
Page 25: Operation And Configuration
In a high-temperature situation, if the thermal control circuit and ACPI MSRs (automatic and on-demand modes) are used simultaneously, the fixed duty cycle determined by automatic mode would take precedence. ® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide25 303730 Order #... -
Page 26: System Considerations
4.2.5 System Considerations Intel requires the Thermal Monitor and Thermal Control Circuit to be enabled for all Celeron D processors in the 775-land LGA package based systems. The thermal control circuit is intended to protect against short term thermal excursions that exceed the capability of a well designed processor thermal solution. -
Page 27: Reading The On-Die Thermal Diode Interface
For the purpose of determining a correction factor to use with the thermal sensor, the ideality equation can be simplified to the following: ® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide27 303730 Order #... -
Page 28: Thermtrip# Signal
THERMTRIP# to activate and shut down the processor. Regardless of the system design requirements or thermal solution ability, the Thermal Monitor feature must still be enabled to ensure proper processor operation. ® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide Order #303730... -
Page 29: How On-Die Thermal Diode, Tcontrol And Thermal Profile Work Together
How On-Die Thermal Diode, T and Thermal Profile Work CONTROL Together The Celeron D Processor in the 775-land LGA package thermal specification is comprised of two parameters, T and Thermal Profile. The first step is to ensure the thermal solution by design CONTROL meets the thermal profile. -
Page 30: Intel Enabled Thermal Solutions
Metrology” on page 18. This is a basic thermal engineering parameter that may be used to evaluate and compare different thermal solutions in similar boundary conditions. For the Celeron D, an example of how Ψ is calculated is shown in Equation Equation 6. -
Page 31: Atx Form Factor
Figure 8. Thermal Characterization Parameters for Various Operating Conditions ATX Form Factor Intel is enabling the following active thermal solutions for the Celeron D Processor in the 775-land LGA package for Embedded Applications in the ATX, similar, or larger form factors. -
Page 32: Copper Heatsink
Intel has worked with a third-party vendor to enable a heatsink design for the Celeron D Processor in the 775-land LGA package for the 1U form factor. This design was optimized for the 1U form factor within the available volume for the thermal solution. -
Page 33: Form Factor
Figure 10. 1U Thermal Solution Z-Height Constraints 2U Form Factor Intel has developed a reference thermal solution design for the Celeron D processor in the 775-land LGA package for the 2U form factor. This design was optimized for the 2U form factor within the available volume for the thermal solution. -
Page 34: Case-To-Ambient Thermal Characterization Parameter Ψ
Figure 12. Case-to-Ambient Thermal Characterization Parameter Ψ (°C/W) Developers of thermal solutions for the Celeron D processor in the 775-land LGA package must ensure that the solution meets the processor thermal specifications as stated in the processor datasheet and follow the recommended motherboard component keep-out as shown in... -
Page 35: Reference Thermal Mechanical Solution
Reference Thermal Mechanical Solution For information regarding the Intel Thermal/Mechanical Reference Design thermal solution and design criteria for the ATX form factor, refer to the Intel Pentium 4 Processor on 90nm Process in the 775-Land LGA Package Thermal Design Guidelines. -
Page 36: Conclusion
This document has presented the conditions and requirements for designing a heatsink solution for a system based on a Celeron D processor in the 775-land LGA package. Properly designed solutions provide adequate cooling to maintain the processor thermal specification. -
Page 37: Lga775 Socket Heatsink Loading
• Mechanical performance in shock and vibration. — Refer to the Intel Pentium 4 Processor on 90nm Process in the 775-Land LGA Package Thermal Design Guide for information on the structural design strategy for the Intel RCBFH-3 Reference Design heatsink. -
Page 38: Board Deflection Definition
Beginning of Life (BOL) deflection, no preload d_BOL BOL deflection with preload d_EOL End of Life (EOL) deflection Figure 14. Board Deflection Definition d’1 d’2 ® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide Order #303730... - Page 39 However, a small amount of creep is accounted for in the plastic fasteners. This situation is somewhat similar to the Intel Reference Design. The impact of the creep on the board deflection is a function of the clip stiffness: •...
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Page 40: Example: Defining Heatsink Preload Meeting Board Deflection Limit
A.2.5 Additional Considerations Intel recommends to design to {d_BOL - d_ref = 0.15mm} at BOL when EOL conditions are not known or difficult to assess The following information is given for illustration only. It is based on the reference keep-out, assuming there is no fixture that changes board stiffness: d_ref is expected to be 0.18 mm on average, and be as high as 0.22 mm. - Page 41 • The Intel RCBFH-3 Reference Design available from licensed suppliers. Intel is also collaborating with vendors participating in its third party test house program to evaluate third party solutions. Vendor information will be available and updated regularly after product launch at http://developer.intel.com. After selecting the processor, go to the processor technical information page, then select Support Component.
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Page 42: Heatsink Clip Load Metrology
The measurement offset depends on the whole assembly stiffness (i.e. board, clip, fastener, etc.). For example, the Intel RCBFH-3 Reference Heatsink Design clip and fastener assembly has a stiffness of around 380 N/mm [2180 lb/in]. -
Page 43: Load Cell Installation In Machined Heatsink Base Pocket - Bottom View
Height of pocket ~ height of selected load cell Load cell protrusion (Note: To be optimized depending on assembly stiffness) ® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide43 303730 Order #... -
Page 44: Preload Test Configuration
The load cells can handle up to 121°C (operating), but their uncertainty increases according to 0.02% rdg/°F. ® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide Order #303730... - Page 45 2. Install the test vehicle in the socket. ® 3. Assemble the heatsink reworked with the load cells to the board as shown for the Intel RCBFH-3 reference heatsink example in Figure 18 and actuate attach mechanism.
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Page 46: Thermal Interface Management
® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide Order #303730... -
Page 47: Case Temperature Reference Methodology
Super glue w/thermal characteristics 49850 Adhesive Accelerator Loctite* 7452 for fast glue curing 18490 Kapton* Tape For holding thermocouple in place Not Available ® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide47 303730 Order #... - Page 48 Note: It is recommended to follow company standard procedures and wear safety items like glasses for cutting the IHS and gloves for chemical handling. Note: Ask your Intel field sales representative if you need assistance to groove and/or install a thermocouple according to the reference process.
- Page 49 Case Temperature Reference Methodology D.14 IHS Groove Cut a groove in the package IHS according to Figure Figure 19. FC-LGA4 Package Reference Groove Drawing ® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide49 303730 Order #...
- Page 50 A larger groove may cause the IHS to warp under the socket load such that it does not represent the performance of an ungrooved IHS on production packages. Inspect parts for compliance to specifications before accepting from machine shop. ® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide Order #303730...
- Page 51 3.2 mm [.125 inch] past the end of groove. Secure it with Kapton* tape (Figure 23). Figure 23. Securing Thermocouple Wires with Kapton* Tape Prior to Attach ® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide51 303730 Order #...
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Page 52: Thermocouple Bead Placement (View 1)
Look in the microscope to perform this task. Place a piece of Kapton* tape to hold the wire inside the groove (Figure 26). Refer to Figure 27 for detailed bead placement. ® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide Order #303730... - Page 53 Press down until the bead is seated at the end of groove on top of the step (see Figure 27 Figure 28). ® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide53 303730 Order #...
- Page 54 Step 5 above. Be careful not to move the thermocouple bead during this step (Figure 30). ® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide Order #303730...
- Page 55 4. Remove the Kapton* tape, straighten the wire in the groove so it lays flat all the way to the end of the groove (Figure 31). Figure 31. Thermocouple Wire Management in the Groove ® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide55 303730 Order #...
- Page 56 7. Curing time for the rest of the adhesive in the groove can be reduced using Loctite* Accelerator 7452. 8. Repeat Step 5 to remove any access adhesive to ensure flat IHS for proper mechanical contact to the heatsink surface. ® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide Order #303730...
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Page 57: Board Level Pwm And Fan Speed Control Requirements
Appendix E Board Level PWM and Fan Speed Control Requirements To utilize all of the features in the Intel reference heatsink design or the Intel boxed processor design, system integrators should verify the following functionality is present in the board design. -
Page 58: Mechanical Drawings
Appendix F Mechanical Drawings The following table lists the mechanical drawings included in this appendix. These drawings refer to the reference thermal mechanical enabling components for the Intel Celeron D Processor in the 775-Land LGA Package. Note: Intel reserves the right to make changes and modifications to the design as necessary. -
Page 59: Atx/Μatx Motherboard Keep-Out Footprint Definition And Height Restrictions
Mechanical Drawings Figure 34. ATX/µATX Motherboard Keep-Out Footprint Definition and Height Restrictions for Enabling Components, Sheet 1 ® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide59 303730 Order #... - Page 60 Mechanical Drawings Figure 35. ATX/µATX Motherboard Keep-Out Footprint Definition and Height Restrictions for Enabling Components, Sheet 2 ® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide Order #303730...
- Page 61 Mechanical Drawings Figure 36. ATX/µATX Motherboard Keep-Out Footprint Definition and Height Restrictions for Enabling Components, Sheet 3 ® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide61 303730 Order #...
- Page 62 Mechanical Drawings Figure 37. 1U/2U Motherboard Component Keep-In Definition, Primary Side ® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide Order #303730...
- Page 63 Mechanical Drawings Figure 38. 1U/2U Motherboard Component Keep-In Definition, Secondary Side ® ® Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide63 303730 Order #...
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Page 64: Vendor Information
(908) 252-9400 wendy@coolermaster.com Note: These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. This list and/or these devices may be subject to change without notice.