Mch Package Dimensions (Top View); Mch Package Dimensions (Side View) - Intel WiFi Link 5100 Design Manual

Figure 2.

MCH Package Dimensions (Top View)

Figure 3.

MCH Package Dimensions (Side View)

4.23 ± 0.146 mm
3.79 ± 0.144 mm
2.44 ± 0.071 mm
0.435 ± 0.025 mm
See note 3
Notes:
1. Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)
2. All dimensions and tolerances conform to ANSI Y14.5M-1994
3. BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm
4. Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped)
orientation after reflow
®
Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
TDG
10
Handling
Exclusion
Area
38.5 mm.
Seating Plane
38.5 mm,
MCH
IHS
42.5 mm.
IHS
®
Intel 5100 MCH Chipset
42.5 mm.
Substrate
0.20 See note 4.
0.20 –C–
See note 1.
July 2008
Order Number: 318676-003US