Symbol MC70 User Manual page 140

A - 2 MC70 User Guide
EDA Technical Specifications (Continued)
Table A-1
Item
Operating System
Memory
Interface/Communications
User Environment
Operating Temperature
Storage Temperature
Charging Temperature
Humidity
Drop Specification
Electrostatic Discharge (ESD)
Sealing
Wireless WAN Data and Voice Communications
Wireless Wide Area (WWAN) radio
Wireless LAN Data and Voice Communications
Wireless Local Area (WLAN) radio
Data Rates Supported
Operating Channels
Security
Spreading Technique
Antenna
Voice Communication
Wireless PAN Data and Voice Communications
Bluetooth
Data Capture Specifications
Options
®
Microsoft Windows Mobile™ 2005
64MB RAM/128MB ROM
RS-232, USB 1.1
14°F to 155°F / -10°C to 68°C
-40° F to 140° F / -40° C to 60° C
32°F to 104°F / 0° C to 40° C
95% non-condensing
4 ft. drop to concrete, 6 drops per 6 sides over operating temperature range;
5 ft. drop to concrete, 2 drops per 6 sides at ambient temperature 73° F/23° C
+/-15kVdc air discharge, +/-8kVdc direct discharge, +/-8kVdc indirect discharge
IP54
eGPRS/GSM (850, 900, 1800 and 1900 MHz)
®
Tri-mode IEEE 802.11a/b/g
1, 2, 5.5, 6, 9, 11, 12, 18, 24, 36, 48, and 54 Mbps
Chan 8-169 (5040 – 5845 MHz) (4920 – 4980 MHz) Japan only
Chan 1-13 (2412-2472 MHz) Chan 14 (2484 MHz) Japan only
Actual operating frequencies depend on regulatory rules and certification agency
WPA, WEP (40 or 128 bit), TKIP, TLS, TTLS (MS-CHAP), TTLS (MS-CHAP v2), TTLS
(CHAP), TTLS-MD5, TTLS-PAP, PEAP-TLS, PEAP (MS-CHAP v2), AES, LEAP
Direct Sequence Spread Spectrum (DSSS) and Orthogonal Frequency Division
Multiplexing (OFDM)
Internal for LAN, External for WAN
Integrated Voice-over-IP ready (P2P, PBX, PTT), Wi-Fi™-certified, IEEE 802.11a/b/g direct
sequence wireless LAN
Class II, v 1.2
2D imager, 1D linear
Description