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14.0
Thermal Solutions
In general, three factors affect the thermal performance of the BGA: package and board materials,
package geometry and use environment. The H-PBGA package utilizes a heat spreader or slug
across the top of the package to dissipate heat efficiently.
Environmental conditions play a critical role in the thermal performance of PBGAs. Ambient
conditions, junction and case temperatures, the device's placement and orientation on a board, in
conjunction with the volume and temperature of air flowing past the unit present a broad range of
possible thermal solutions. The profiles of the H-PBGA package are characterized in
Table 14-20. H-PBGA Package Characteristics
Description
Die Junction temperature
Case Temperature (maximum)
Ambient temperature
Airflow (on motherboard) from system fan
Airflow (on add-in card)
Passive heatsink dimensions
Acceptable flange adds 5 mm per side on hole direction of
fan
Maximum heatsink thickness
Clip Hole Pattern
Heatsink Flatness
a.
Case temperature is dependent on the ambient temperature and airflow surrounding the processor. Refer to the application
note "Thermal Data for the 540-Lead PBGA Package" for more information.
14.1
Thermal Recommendations
Refer to the thermal sections of the Intel
80960 RN I/O Processor Datasheet (273157), and the Intel
(273328) and to the thermal section of the Thermal Data for the 540-Lead PBGA Package
Application Note (273390).
Design Guide
Intel® i960® RM/RN I/O Processor
Criteria
110 ° C
a
90 ° C
up to 55 ° C
up to 50 LFM (worst case)
0 LFM (worst case)
Clip = 45 mm x 45 mm < 11 mm (thickness)
Flange type =55 mm x 45 mm <11 mm
(thickness) with pins.
*
<11 mm
4 holes (3.175 mm diameter), 48.4632 x 34.798
mm rectangular (see
Figure
14-34)
From center of heatsink to 1/2 inch in x and y
directions, 2 mils maximum
®
80960 RM I/O Processor Datasheet (273156), the Intel
®
80960 RS I/O Processor Datasheet
Thermal Solutions
Table
14-20.
Figure 14-33
and
®
53
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