Altitude; Reference Heatsink Thermal Validation; Environmental Reliability Testing; Structural Reliability Testing - Intel E2180 - Pentium Dual-Core 2.00GHz 800MHz 1MB Socket 775 CPU Design Manuallines

Table 5-3. VR Airflow Requirements

Minimum VR bypass airflow for
775_VR_CONFIG_06 processors
NOTES:
1.
2.
5.1.5

Altitude

The reference TMA will be evaluated at sea level. However, many companies design
products that must function reliably at high altitude, typically 1,500 m [5,000 ft] or
more. Air-cooled temperature calculations and measurements at sea level must be
adjusted to take into account altitude effects like variation in air density and overall
heat capacity. This often leads to some degradation in thermal solution performance
compared to what is obtained at sea level, with lower fan performance and higher
surface temperatures. The system designer needs to account for altitude effects in the
overall system thermal design to make sure that the T
is met at the targeted altitude.
5.1.6

Reference Heatsink Thermal Validation

The Intel reference heatsink will be validated within the specific boundary conditions
based on the methodology described Section 5.2.
Testing is done in a BTX chassis at ambient lab temperature. The test results, for a
number of samples, will be reported in terms of a worst-case mean + 3σ value for
thermal characterization parameter using real processors (based on the thermal test
vehicle correction factors).
5.2

Environmental Reliability Testing

5.2.1

Structural Reliability Testing

Structural reliability tests consist of unpackaged, system -level vibration and shock
tests of a given thermal solution in the assembled state. The thermal solution should
meet the specified thermal performance targets after these tests are conducted;
however, the test conditions outlined here may differ from your own system
requirements.
46
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information
Item
This is the recommended airflow rate that should be delivered to the VR when the VR
power is at a maximum in order to support the 775_VR_CONFIG_06 processors at TDP
power dissipation and the chassis external environment temperature is at 35 ºC. Less
airflow is necessary when the VR power is not at a maximum or if the external ambient
temperature is less than 35 ºC.
This recommended airflow rate is based on the requirements for the Intel
Chipset Family.
Target
2.4 CFM
requirement for the processor
C
Thermal and Mechanical Design Guidelines
®
965 Express