Processor; Bios; Chipset; Memory - Advantech MIC-3396 User Manual

6u compactpci 4th generation intel core™ i3/i5/i7 processor blade with ecc support
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1.2.3

Processor

Table 1.1: Processor Type
Intel CPU
CPU
Model
architec-
Number
ture
Haswell
i3-4100E
(22nm)
Haswell
I5-4402E
(22nm)
Haswell
I5-4400E
(22nm)
Haswell
I7-4700EQ
(22nm)
Because power consumption and thermal restrictions vary between dif-
Note!
ferent CompactPCI systems, please double check these items before
installing a higher speed CPU not listed in the table above.
1.2.4

BIOS

An 8 MB SPI flash contain a board-specific BIOS (from AMI) designed to meet indus-
trial and embedded system requirements.
1.2.5

Chipset

The Intel Mobile QM87 chipset provides excellent flexibility for developers of embed-
ded applications by offering improved graphics and increased I/O bandwidth over
previous Intel chipsets, as well as remote asset management capabilities and
improved storage speed and reliability.
The Mobile Intel QM87 chipset offers up to 5 GT/s for fast access to peripheral
devices.
It delivers outstanding system performance through high bandwidth interfaces such
as PCI Express, Serial ATA and Hi-Speed USB 2.0 and USB 3.0.
1.2.6

Memory

The MIC-3396 has up to 8 GB of onboard with ECC support DDR3L memory. It also
has one 240-pin SO-DIMM socket that can accommodate an additional 2GB (max. to
8GB) of memory. The following table shows a list of SO-DIMM modules that have
been tested on the MIC-3396.
Table 1.2: Memory Type
Brand
Size
8 GB DDR3L 1600
ATP
8 GB DDR3L 1600
Transcend
4 GB DDR3L 1600
#
# Cores
Freq.
Threads
2
4
2.4 GHz 3MB
2
4
1.6 GHz 3MB
2
4
2.7GHz 3MB
4
8
2.2GHz 6MB
Speed
Vendor PN
AW24P7228BLK0S
XW1628E8GSP9-AV Yes
A63873-0011
3
CPU
Cache DMI
Package
TDP
5GT/s 37W FCBGA
5GT/s 25W
FCBGA 30 CFM
5GT/s 37W FCBGA
5GT/s 47W FCBGA
ECC
Pin Count
Yes
204 - pin
204 - pin
Yes
204 - pin
MIC-3396 User Manual
Required
airflow
30 CFM
30 CFM
30 CFM
Memory
Chip
Samsung
Samsung
Samsung

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