Notes On Repair Parts; Unleaded Solder - Sony HXCU-100 Service Manual

2-10. Notes on Repair Parts

1. Safety Related Components Warning
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Components marked ! are critical to safe operation. Therefore, specifi ed parts should be used in the
case of replacement.
2. Standardization of Parts
Some repair parts supplied by Sony differ from those used for the unit. These are because of parts
commonality and improvement.
3. Stock of Parts
Parts marked with "o" at SP (Supply Code) column of the spare parts list may not be stocked. There-
fore, the delivery date will be delayed.
4. Harness
Harnesses with no part number are not registered as spare parts.

2-11. Unleaded Solder

Boards requiring use of lead-free solder are printed with a lead free mark (LF) indicating the solder
contains no lead.
(Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular
size.)
: LEAD FREE MARK
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. Be sure to use the lead-free solder for the printed circuit board printed with the lead free mark.
. The lead-free solder melts at a temperature about 40 dC higher than the ordinary solder, therefore, it is
recommended to use the soldering iron having a temperature regulator.
. The ordinary soldering iron can be used but the iron tip has to be applied to the solder joint for a slightly
longer time. The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so
be careful.
2-20 (E)
HXCU-100