Sony HXCU-100 Service Manual page 117

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DPR-300 BOARD
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Ref. No.
or Q'ty Part No. SP Description
1pc A-1708-255-A s MOUNTED CIRCUIT BOARD, DPR-300
6pcs 2-640-315-02 o SCREW (M2X5), SMALL, +P, SW
1pc 3-179-085-01 s LEVER (L), PC BOARD
6pcs 4-382-854-51 s SCREW (M3X6), P, SW (+)
C21 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C22 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C201 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C202 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C203 1-164-845-81 s CAP, CHIP CERAMIC 5PF CH 1005
C204 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C205 1-164-935-81 s CAP, CHIP CERAMIC 470PF B 1005
C206 1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C207 1-164-846-81 s CAP, CHIP CERAMIC 6PF CH 1005
C208 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C209 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C210 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C211 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C212 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C213 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C214 1-162-919-91 s CAP, CERAMIC 22PF CH 1608
C215 1-162-919-91 s CAP, CERAMIC 22PF CH 1608
C216 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C217 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C218 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C219 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C220 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C221 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C222 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C223 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C224 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C225 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C226 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C227 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C228 1-127-692-91 s CAP, CHIP CERAMIC 10MF B 3225
C229 1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005
C230 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C231 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C232 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C233 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C234 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C235 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C236 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C237 1-112-021-91 s CAP, CERAMIC 2.2MF C (1608)
C238 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C239 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C240 1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005
C242 1-164-882-81 s CAP,CHIP CERAMIC 220PF CH 1005
C244 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C245 1-164-858-81 s CAP, CHIP CERAMIC 22PF CH 1005
C246 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C247 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C248 1-164-846-81 s CAP, CHIP CERAMIC 6PF CH 1005
C249 1-164-848-81 s CAP, CHIP CERAMIC 8PF CH 1005
C250 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C252 1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005
C254 1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005
C255 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C256 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C257 1-164-842-81 s CAP,CHIP CERAMIC 2.0PF CK 1005
HXCU-100
(DPR-300 BOARD)
Ref. No.
or Q'ty Part No. SP Description
C259 1-164-858-81 s CAP, CHIP CERAMIC 22PF CH 1005
C261 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C262 1-164-844-81 s CAP, CHIP CERAMIC 4PF CH 1005
C263 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C264 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C265 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C266 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C267 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C268 1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005
C269 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C270 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C271 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C272 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C273 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C274 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C275 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C276 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C277 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C278 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C279 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C280 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C281 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C282 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C283 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C284 1-127-692-91 s CAP, CHIP CERAMIC 10MF B 3225
C285 1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005
C286 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C287 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C288 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C289 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C290 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C291 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C292 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C293 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C294 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C295 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C296 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C297 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C299 1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005
C301 1-100-671-91 s CAP, CERAMIC 4.7MF C (3216)
C302 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C303 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C304 1-115-339-91 s CAP, CERAMIC 0.1MF B (2012)
C305 1-114-236-21 s CAP, CERAMIC 22MF B (3225)
C306 1-114-236-21 s CAP, CERAMIC 22MF B (3225)
C307 1-114-236-21 s CAP, CERAMIC 22MF B (3225)
C308 1-114-236-21 s CAP, CERAMIC 22MF B (3225)
C309 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C310 1-114-214-81 s CAP,CHIP CERAMIC470PF CH1005
C311 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C313 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C314 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C315 1-165-875-91 s CAP, CHIP CERAMIC 10MF B 3216
C316 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C317 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C318 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C319 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C320 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C321 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
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