Sony HXCU-100 Service Manual page 166
Hd camera control unit
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Also See for HXCU-100:
- Operating instructions manual (149 pages) ,
- Operating instructions manual (32 pages)
Table of Contents
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(SY-364 BOARD)
Ref. No.
or Q'ty Part No.
SP Description
C56
1-126-391-21 s CAP, CHIP ELECT 47MF (5X5.7)
C57
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C58
1-126-399-21 s CAP, CHIP ELECT 10MF (5X5.7)
C59
1-164-878-81 s CAP,CHIP CERAMIC 150PF CH 1005
C60
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C61
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C62
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C63
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C64
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C65
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C66
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C67
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C68
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C69
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C70
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C71
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C72
1-117-144-21 s CAP, ELECT 0.47MF
C73
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C74
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C75
1-127-956-21 s CAP, CHIP FILM 0.1MF (3225)
C76
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C77
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C78
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C79
1-127-956-21 s CAP, CHIP FILM 0.1MF (3225)
C80
1-127-956-21 s CAP, CHIP FILM 0.1MF (3225)
C81
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C82
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C83
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C84
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C85
1-127-956-21 s CAP, CHIP FILM 0.1MF (3225)
C86
1-164-845-81 s CAP, CHIP CERAMIC 5PF CH 1005
C87
1-164-858-81 s CAP, CHIP CERAMIC 22PF CH 1005
C88
1-127-956-21 s CAP, CHIP FILM 0.1MF (3225)
C89
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C90
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C91
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C92
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C93
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C94
1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005
C95
1-126-399-21 s CAP, CHIP ELECT 10MF (5X5.7)
C96
1-164-878-81 s CAP,CHIP CERAMIC 150PF CH 1005
C97
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C98
1-126-391-21 s CAP, CHIP ELECT 47MF (5X5.7)
C99
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C100
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C101
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C102
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C103
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C104
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C105
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C106
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C107
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C108
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C109
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C110
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C111
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C112
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C113
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C114
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
7-60
(SY-364 BOARD)
Ref. No.
or Q'ty Part No.
SP Description
C115
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C116
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C117
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C118
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C119
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C120
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C121
1-127-956-21 s CAP, CHIP FILM 0.1MF (3225)
C122
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C123
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C124
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C125
1-127-956-21 s CAP, CHIP FILM 0.1MF (3225)
C126
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C127
1-127-956-21 s CAP, CHIP FILM 0.1MF (3225)
C128
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C129
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C130
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C131
1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005
C132
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C133
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C134
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C135
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C136
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C137
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C138
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C139
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C140
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C141
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C142
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C143
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C144
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C145
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C146
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C147
1-164-845-81 s CAP, CHIP CERAMIC 5PF CH 1005
C148
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C149
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C150
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C151
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C152
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C153
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C154
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C155
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C156
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C158
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C159
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C160
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C161
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C162
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C163
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C164
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C165
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C166
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C167
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C168
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C169
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C170
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C171
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C172
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C173
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C174
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
HXCU-100
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