Sony HXCU-100 Service Manual page 155
Hd camera control unit
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Also See for HXCU-100:
- Operating instructions manual (149 pages) ,
- Operating instructions manual (32 pages)
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DY-23 BOARD
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Ref. No.
or Q'ty Part No.
SP Description
1pc
A-1707-199-A s MOUNTED CIRCUIT BOARD, DY-23
C101
1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C102
1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C103
1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C104
1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C105
1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C106
1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C107
1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C108
1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C109
1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C112
1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C113
1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C114
1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C115
1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C301
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C302
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C303
1-100-881-91 s CAP, CERAMIC 47MF C (3216)
C304
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C305
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C306
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C307
1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C308
1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C309
1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C311
1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C312
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C313
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C314
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C315
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C316
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C317
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C318
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C319
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C320
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C321
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C322
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C323
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C324
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C325
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C326
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C327
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C328
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C329
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C330
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C331
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C332
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C333
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C334
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C335
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C336
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C337
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C338
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C339
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C340
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C341
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C342
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C343
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C344
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C345
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
HXCU-100
(DY-23 BOARD)
Ref. No.
or Q'ty Part No.
SP Description
C346
1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C347
1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C401
1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C402
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C403
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C404
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C405
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C406
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C407
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C408
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C409
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C410
1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C411
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C412
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C413
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C414
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C415
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C416
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C417
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C418
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
CN102
1-784-625-31 s CONNECTOR, FFC/FPC(ZIF) AN 30P
CN103
1-784-625-31 s CONNECTOR, FFC/FPC(ZIF) AN 30P
D102
6-502-197-01 s DI SML-D12M8WT86SM
D103
8-719-820-42 s DIODE 1SS302-TE85L
FB101
1-469-094-21 s FERRITE, EMI (SMD) (1608)
FB301
1-469-094-21 s FERRITE, EMI (SMD) (1608)
FB304
1-469-094-21 s FERRITE, EMI (SMD) (1608)
FB305
1-469-094-21 s FERRITE, EMI (SMD) (1608)
FB401
1-469-094-21 s FERRITE, EMI (SMD) (1608)
FB402
1-469-094-21 s FERRITE, EMI (SMD) (1608)
FB403
1-469-094-21 s FERRITE, EMI (SMD) (1608)
FB404
1-469-094-21 s FERRITE, EMI (SMD) (1608)
IC101
6-712-135-01 o IC R1173H001D-T1-F
IC301
6-712-135-01 o IC R1173H001D-T1-F
L301
1-414-392-41 s INDUCTOR (SMD) 1.0UH
L302
1-414-392-41 s INDUCTOR (SMD) 1.0UH
L303
1-414-392-41 s INDUCTOR (SMD) 1.0UH
R101
1-208-855-81 s RES, CHIP 47 (1005)
R102
1-208-855-81 s RES, CHIP 47 (1005)
R104
1-208-855-81 s RES, CHIP 47 (1005)
R105
1-208-855-81 s RES, CHIP 47 (1005)
R107
1-208-903-81 s RES, CHIP 4.7K (1005)
R108
1-208-871-81 s RES, CHIP 220 (1005)
R109
1-208-919-81 s RES, CHIP 22K (1005)
R110
1-208-911-81 s RES, CHIP 10K (1005)
R111
1-208-911-81 s RES, CHIP 10K (1005)
R112
1-208-895-81 s RES, CHIP 2.2K (1005)
R114
1-218-990-81 s CONDUCTOR, CHIP (1005)
R205
1-220-870-81 s RES, CHIP 10 (1005)
R206
1-208-887-81 s RES, CHIP 1.0K (1005)
R207
1-208-887-81 s RES, CHIP 1.0K (1005)
R208
1-218-990-81 s CONDUCTOR, CHIP (1005)
R209
1-220-878-81 s RES, CHIP 22 (1005)
R210
1-220-878-81 s RES, CHIP 22 (1005)
R301
1-208-911-81 s RES, CHIP 10K (1005)
R302
1-220-878-81 s RES, CHIP 22 (1005)
R303
1-220-878-81 s RES, CHIP 22 (1005)
7-49
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