Figure 6. Dimm Socket Configuration - Intel SE7520AF2 Technical Product Specification

Intel® Server Board SE7520AF2 TPS
DIMM and memory configurations must adhere to the following:
DDR2-400 MHz registered ECC DIMM modules
DIMM organization: x72 ECC
Pin count: 240 pins
DIMM capacity: 256 MB, 512 MB, 1 GB, 2 GB, 4 GB DIMMs using current SDRAM
densities
Support up to 16 GB of system memory capacity
Support a maximum of four ranks per channel
Serial PD: JEDEC Rev 2.0
Voltage options: 1.8 V (VDD/VDDQ)
Interface: SSTL2
Two DIMMs must be populated in a bank for a x144 wide memory data path
DIMMs must be populated beginning with the socket furthest away from the MCH (i.e.
DIMM 1B and DIMM 1A)
DIMMs must be identical within the same bank. For example, the DIMM in socket DIMM
1A must be identical to the DIMM in socket DIMM 1B)
1
Note that in order to populate 8 DIMM modules on the board, all DIMMs must be single rank. Refer to the DIMM
manufacturer specification to determine the number of ranks on the specific DIMM intended to be used.
Revision 1.2
MCH
Bank 4

Figure 6. DIMM Socket Configuration

Intel order number C77866-003
Bank 3 Bank 2 Bank 1
1
Functional Architecture
43