Table Of Contents - Intel Core i7 Extreme Edition Datasheet

Contents
1 Introduction .............................................................................................................. 9
1.1 Terminology ..................................................................................................... 10
1.2 References ....................................................................................................... 11
2 Electrical Specifications ........................................................................................... 13
2.1 Intel® QPI Differential Signaling ......................................................................... 13
2.2 Power and Ground Lands.................................................................................... 13
2.3 Decoupling Guidelines ........................................................................................ 13
2.3.1 VCC, VTTA, VTTD, VDDQ Decoupling......................................................... 14
2.4 Processor Clocking (BCLK_DP, BCLK_DN) ............................................................. 14
2.4.1 PLL Power Supply ................................................................................... 14
2.5 Voltage Identification (VID) ................................................................................ 14
2.6 Reserved or Unused Signals................................................................................ 17
2.7 Signal Groups ................................................................................................... 18
2.8 Test Access Port (TAP) Connection....................................................................... 19
2.9 Platform Environmental Control Interface (PECI) DC Specifications........................... 20
2.9.1 DC Characteristics .................................................................................. 20
2.9.2 Input Device Hysteresis .......................................................................... 21
2.10 Absolute Maximum and Minimum Ratings ............................................................. 21
2.11 Processor DC Specifications ................................................................................ 22
2.11.1 DC Voltage and Current Specification ........................................................ 23
2.11.2 VCC Overshoot Specification .................................................................... 29
2.11.3 Die Voltage Validation ............................................................................. 30
3 Package Mechanical Specifications .......................................................................... 31
3.1 Package Mechanical Drawing............................................................................... 31
3.2 Processor Component Keep-Out Zones ................................................................. 34
3.3 Package Loading Specifications ........................................................................... 34
3.4 Package Handling Guidelines............................................................................... 34
3.5 Package Insertion Specifications.......................................................................... 34
3.6 Processor Mass Specification ............................................................................... 35
3.7 Processor Materials............................................................................................ 35
3.8 Processor Markings............................................................................................ 35
3.9 Processor Land Coordinates ................................................................................ 36
4 Land Listing............................................................................................................. 37
5 Signal Definitions .................................................................................................... 73
5.1 Signal Definitions .............................................................................................. 73
6 Thermal Specifications ............................................................................................ 77
6.1 Package Thermal Specifications ........................................................................... 77
6.1.1 Thermal Specifications ............................................................................ 77
6.1.2 Thermal Metrology ................................................................................. 81
6.2 Processor Thermal Features ................................................................................ 82
6.2.1 Processor Temperature ........................................................................... 82
6.2.2 Adaptive Thermal Monitor........................................................................ 82
6.2.3 THERMTRIP# Signal ............................................................................... 85
6.3 Platform Environment Control Interface (PECI) ...................................................... 85
6.3.1 Introduction .......................................................................................... 85
6.3.2 PECI Specifications ................................................................................. 87
6.4 Storage Conditions Specifications ........................................................................ 88
7 Features .................................................................................................................. 89
7.1 Power-On Configuration (POC) ............................................................................ 89
Datasheet 3