Table of Contents
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Contents
Contents
1.0
Product Description ................................................................................................... 7
1.1
Overview .......................................................................................................... 7
1.1.1
Feature Summary ................................................................................... 7
1.1.2
Board Layout .......................................................................................... 9
1.2
Processors........................................................................................................ 11
1.3
System Memory ................................................................................................ 11
1.3.1
DDR2-400 DIMM Slot Populations ............................................................. 11
1.3.2
DDR2 DIMM Ordering Overview................................................................ 12
®
1.4
3100 Chipset........................................................................................... 14
1.4.1
On-Board Peripherals .............................................................................. 14
1.4.2
On-Board I/O......................................................................................... 15
1.4.3
I/O Slots for Expansion Capabilities .......................................................... 17
1.4.4
Rear Panel I/O Connectors....................................................................... 18
1.4.5
Hardware Server Management Features .................................................... 19
1.5
Supported Operating Systems............................................................................. 20
1.6
Supported BIOS Features ................................................................................... 21
1.6.1
ACPI..................................................................................................... 21
1.7
Power Supply.................................................................................................... 22
1.8
Thermal and Mechanical Components................................................................... 22
1.8.1
Heatsinks .............................................................................................. 23
1.9
Physical and Mechanical Board Specifications ........................................................ 25
1.9.1
Mounting Holes ...................................................................................... 25
1.10
Debug Ports ..................................................................................................... 25
1.11
Real Time Clock (RTC), CMOS SRAM, and Battery .................................................. 25
2.0
Platform Setup ........................................................................................................ 26
2.1
Connecting the Wires ......................................................................................... 26
2.1.1
Connect SATA cables .............................................................................. 27
2.1.2
Plugging In Memory................................................................................ 27
2.1.3
Connecting the Processor ........................................................................ 28
2.1.4
Connecting Heatsinks and Fans ................................................................ 28
2.2
Connecting Other Peripherals .............................................................................. 30
2.2.1
Add-in Connectors .................................................................................. 30
2.2.2
Rear Panel Connectors ............................................................................ 31
2.2.3
Connecting a Floppy Drive ....................................................................... 32
2.2.4
Changing and/or Updating the BIOS Chip .................................................. 32
2.2.5
Changing the CMOS Battery and Clearing CMOS ......................................... 33
2.3
Connect Power .................................................................................................. 33
2.4
Turning On and Resetting the Board .................................................................... 36
3.0
Technical Reference ................................................................................................ 37
3.1
Memory Resources ............................................................................................ 37
3.2
DMA Channels .................................................................................................. 37
3.3
Fixed I/O Map ................................................................................................... 37
3.4
Interrupts ....................................................................................................... 37
3.5
PCI Conventional Interrupt Routing Map ............................................................... 38
3.6
Connectors ....................................................................................................... 39
3.6.1
Back Panel Connectors ............................................................................ 39
3.6.2
Component Side Connectors ................................................................... 39
3.7
Jumper Block .................................................................................................... 43
3.8
Mechanical Considerations .................................................................................. 46
3.8.1
Form Factor........................................................................................... 46
June 2007
Order Number: 316639-002
User's Manual
3
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