Omron V680 Series User Manual page 159

Applicable Models
V680-D8KF68/D32KF68
Chemicals that affect ID Tags are shown below.
Polybutylene terephthalate (PBT) resin is used for case material and epoxy resin for filling material.
Refer to the following lists and do not use chemicals that affect PBT and epoxy resins.
ID Tags cannot be used in applications with explosion-proof specifications.
Chemicals That Cause Deformations, Cracks, Etc.
PBT resin
Acetone, trichloroethylene, ethylene dichloride, sodium
hydroxide, and other alkaline substances
Chemicals That May Cause Discoloration, Swelling, Etc.
PBT resin
Hydrochloric acid (10% RT), acetic acid (5% RT), benzene
Chemicals that Do Not Affect PPS Resin or Epoxy Resin
PBT resin
Nitric acid (30% RT), concentrated hydrochloric acid, acetic
acid, ethyl acetate (100% RT), potassium permaganate (5%
RH), ethyl acetate, carbon tetrachloride, methanol, ethanol,
gasoline
Note: The above results are from tests conducted at room temperature (23°C). Even if the chemicals
do not affect the PPS or epoxy resins at room temperature, they may affect the resins at higher
or lower temperatures. Check the chemicals carefully in advance.
MEMO
Epoxy resin
Aqua regia, chromic acid, sulfuric acid (90% RT), nitric acid
(60% RT), liquid ammonia, acetone, methylene chloride,
phenol
Epoxy resin
Sulfuric acid (10% RT), nitric acid (10% RT), concentrated
hydrochloric acid, acetic acid (50% RT), oxalic acid, calcium
hydroxide, benzene, cresol, alcohol, microhexanon, toluene,
xylene, benzene, grease
Epoxy resin
Ammonia, hydrochloric acid (10% RT), potassium hydrate,
petroleum, gasoline, Yushiroken S50, Chemi-cool Z, Velocity
No. 3, Yushiroken EEE-30Y, methyl ethyl ketone, sodium
hydroxide
Section 7
Appendices
RFID System
157
User's Manual