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5.5
System Validation
System validation should focus on ensuring the fan speed control algorithm is
responding appropriately to the DTS values and T
device being monitored for thermal compliance.
Since the processor thermal solution has already been validated using the TTV to the
thermal specifications at the predicted T
chassis is not expected to be necessary.
Once the heatsink has been demonstrated to meet the TTV Thermal Profile, it should be
evaluated on a functional system at the boundary conditions.
In the system under test and Power/Thermal Utility Software set to dissipate the TDP
workload confirm the following item:
• Verify if there is TCC activity by instrumenting the PROCHOT# signal from the
processor. TCC activation in functional application testing is unlikely with a
compliant thermal solution. Some very high power applications might activate TCC
for short intervals this is normal.
• Verify fan speed response is within expectations - actual RPM (Ψ
with DTS temperature and T
• Verify RPM vs. PWM command (or voltage) output from the FSC device is within
expectations.
• Perform sensitivity analysis to asses impact on processor thermal solution
performance and acoustics for the following:
— Other fans in the system.
— Other thermal loads in the system.
In the same system under test, run real applications that are representative of the
expected end user usage model and verify the following:
• TCC activation is not occurring.
• Verify fan speed response vs. expectations as done using Power/Thermal Utility
SW.
• Validate system boundary condition assumptions: Trise, venting locations, other
thermal loads and adjust models / design as required.
36
Sensor Based Thermal Specification Design Guidance
AMBIENT
, additional TTV based testing in the
AMBIENT
.
AMBIENT
data as well as any other
) is consistent
CA
Thermal/Mechanical Design Guide
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