Board Layout; Lga1366 Socket Land Pattern (Top View Of Board) - Intel BX80616I3540 Design Manual

LGA1366 Socket
2.1

Board Layout

The land pattern for the LGA1366 socket is 40 mils X 40 mils (X by Y), and the pad size
is 18 mils. Note that there is no round-off (conversion) error between socket pitch
(1.016 mm) and board pitch (40 mil) as these values are equivalent.
Figure 2-3.

LGA1366 Socket Land Pattern (Top View of Board)

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Thermal/Mechanical Design Guide
A C E G J L N
B D F H K M P
A C E G J L N R
B D F H K M P
R U W AA AC AE AG AJ AL AN AR AU AW BA
T V Y AB AD AF AH AK AM AP AT AV AY
U W AA AC AE AG AJ AL AN AR AU AW BA
T V Y AB AD AF AH AK AM AP AT AV AY
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