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Term
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as
Ψ
(T
CS
Note: Heat source must be specified for
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as
Ψ
(T
SA
Note: Heat source must be specified for
Thermal Interface Material: The thermally conductive compound between the heatsink
TIM
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.
The maximum power dissipated by a semiconductor component.
P
MAX
Thermal Design Power: a power dissipation target based on worst-case applications.
TDP
Thermal solutions should be designed to dissipate the thermal design power.
Integrated Heat Spreader: a thermally conductive lid integrated into a processor
IHS
package to improve heat transfer to a thermal solution through heat spreading.
The surface mount socket designed to accept the processors in the 775–Land LGA
LGA775
package.
Socket
Advanced Configuration and Power Interface.
ACPI
Bypass is the area between a passive heatsink and any object that can act to form a
Bypass
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
Thermal
A feature on the processor that attempts to keep the processor die temperature within
Monitor
factory specifications.
Thermal Control Circuit: Thermal Monitor uses the TCC to reduce die temperature by
TCC
lowering effective processor frequency when the die temperature has exceeded its
operating limits.
T
Temperature reported from the on-die thermal diode.
DIODE
Fan Speed Control: Thermal solution that includes a variable fan speed which is driven
FSC
by a PWM signal and uses the on-die thermal diode as a reference to change the duty
cycle of the PWM signal.
T
T
CONTROL
CONTROL
Pulse width modulation is a method of controlling a variable speed fan. The enabled 4
PWM
wire fans use the PWM duty cycle % from the fan speed controller to modulate the fan
speed.
Health
Any standalone or integrated component that is capable of reading the processor
Monitor
temperature and providing the PWM signal to the 4 pin fan header.
Component
BTX
Balanced Technology Extended.
Thermal Module Assembly. The heatsink, fan and duct assembly for the BTX thermal
TMA
solution
14
– T
) / Total Package Power.
C
S
– T
) / Total Package Power.
S
A
is the specification limit for use with the on-die thermal diode.
Description
Ψ
measurements.
Ψ
measurements.
§
Thermal and Mechanical Design Guidelines
Introduction
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