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31. Lift the heater block and magnified lens, using tweezers quickly rotate the device
90 degrees clockwise. Using the back of the tweezers press down on the solder
this will force out the excess solder
Figure 7-30. Removing Excess Solder
32. Allow the device to cool down. Blowing compressed air on the device can
accelerate the cooling time. Monitor the device IHS temperature with a handheld
meter until it drops below 50 °C before moving it to the microscope for the final
steps
104
Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines
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