Intel E1400 - Celeron 2.0GHz 800MHz 512KB Socket 775 Dual-Core CPU Design Manual page 5

A.2.1
A.2.2
A.2.3
A.2.4
A.2.5
A.3 Heatsink Selection Guidelines.................................................................80
Appendix B Heatsink Clip Load Metrology ............................................................................81
B.1 Overview ............................................................................................81
B.2 Test Preparation...................................................................................81
B.2.1
B.2.2
B.3 Test Procedure Examples.......................................................................84
B.3.1
B.3.2
Appendix C Thermal Interface Management.........................................................................87
C.1 Bond Line Management .........................................................................87
C.2 Interface Material Area..........................................................................87
C.3 Interface Material Performance...............................................................87
Appendix D Case Temperature Reference Metrology.............................................................. 89
D.1 Objective and Scope .............................................................................89
D.2 Supporting Test Equipment....................................................................89
D.3 Thermal Calibration and Controls ............................................................91
D.4 IHS Groove .........................................................................................91
D.5 Thermocouple Attach Procedure .............................................................95
D.5.1
D.5.2
D.5.3
D.5.4
D.6 Thermocouple Wire Management .......................................................... 108
Appendix E Legacy Fan Speed Control .............................................................................. 109
E.1 Thermal Solution Design ..................................................................... 109
E.1.1
E.1.2
E.2 Board and System Implementation ....................................................... 111
E.2.1
E.3 Combining Thermistor and On-Die Thermal Sensor Control....................... 115
E.4 Interaction of Thermal Profile and T
Appendix F Balanced Technology Extended (BTX) System Thermal Considerations.................. 121
Appendix G Fan Performance for Reference Design ............................................................. 125
Appendix H Mechanical Drawings ..................................................................................... 128
Appendix I Intel Enabled Reference Solution Information.................................................... 146
Thermal and Mechanical Design Guidelines
Heatsink Preload Requirement Limitations...................................75
Motherboard Deflection Metric Definition..................................... 76
Board Deflection Limits ............................................................77
Board Deflection Metric Implementation Example ......................... 78
Additional Considerations .........................................................79
Heatsink Preparation................................................................81
Typical Test Equipment ............................................................84
Time-Zero, Room Temperature Preload Measurement ...................85
Preload Degradation under Bake Conditions ................................85
Thermocouple Conditioning and Preparation ................................95
Thermocouple Attachment to the IHS .........................................96
Solder Process ...................................................................... 101
Cleaning and Completion of Thermocouple Installation................ 105
Determine Thermistor Set Points ............................................. 109
Minimum Fan Speed Set Point ................................................. 110
Choosing Fan Speed Control Settings ....................................... 111
............................................. 115
CONTROL
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