Contents
1
Introduction ...................................................................................................11
1.1
1.1.1
1.1.2
1.1.3
1.2
References ..........................................................................................13
1.3
Definition of Terms ...............................................................................13
2
2.1
2.1.1
2.1.2
2.2
2.2.1
2.2.2
2.2.3
2.3
2.3.1
2.3.2
2.3.3
2.3.4
2.4
2.4.1
2.4.2
2.4.3
2.5
3
Thermal Metrology ..........................................................................................27
3.1
3.1.1
3.2
3.3
3.4
4
4.1
4.2
4.2.1
4.2.2
4.2.3
4.2.4
4.2.5
4.2.6
4.2.7
4.2.8
4.2.9
Thermal and Mechanical Design Guidelines
Document Goals......................................................................11
Document Scope .....................................................................12
Processor Package ................................................................... 15
Heatsink Attach ......................................................................17
Thermal Profile .......................................................................19
..................................................................................20
Heatsink Size.......................................................................... 22
Heatsink Mass.........................................................................22
Summary ...............................................................................25
Example ................................................................................28
PROCHOT# Signal ................................................................... 34
Thermal Monitor 2 ...................................................................35
On-Demand Mode ...................................................................37
THERMTRIP# Signal................................................................. 38
3