Microchip Technology MEC172 Series Layout Manual page 6

AN3759
1.3 CAP Pins, AVSS/GND Connection
The recommended filtering for the CAP pin on the MEC1721/MEC1723 is shown in
The filtering components shown should be placed close to the device and away from noise sources.
FIGURE 1-3: WFBGA CAP PIN REFERENCE AND AVSS DIRECTLY CONNECTED TO GND
1.4 BGA Package PCB Layout Considerations
The MEC1721/MEC1723 devices have BGA RoHS-Compliant package as follows:
• 176-pin WFBGA/LJ: 11mm x 11mm, 0.8mm ball pitch (see
• 144-pin WFBGA/SZ (see
Note: Please refer to the latest data sheet for most up-to-date PCB LAND pattern information.
The following list summarizes BGA routing guidelines, but it is understood that final layout is process- dependent and
your design should reflect your needs:
• Through-hole vias technology is not recommended for pitches less than 0.8mm (unless the ball matrix is depopu-
lated in the center)
• NSMD ball pads for pitches 0.8mm – 0.4mm
• Solder Mask to be 1:1 scale of the land size, when routing 0.5mm pitch ball pads
• Vias – next generation PCB technology for tighter pitches
• Eliminate through-hole vias
• Increase routing density & enhance electrical performance
• Decrease routing layers
• Provide fan-out solutions for multiple layers (stacked Vias)
DS00003759B-page 6
Figure 1-5)
Figure
Figure 1-4)
 2021 Microchip Technology Inc. and its subsidiaries
1-3, for WFBGA connections.