Cypress Semiconductor Perform CY7C1380D Manual

Cypress Semiconductor Perform CY7C1380D Manual

18-mbit (512k x 36/1m x 18) pipelined sram

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Features
Supports bus operation up to 250 MHz
Available speed grades are 250, 200, and 167 MHz
Registered inputs and outputs for pipelined operation
3.3V core power supply
2.5V or 3.3V I/O power supply
Fast clock-to-output times
2.6 ns (for 250 MHz device)
Provides high performance 3-1-1-1 access rate
User selectable burst counter supporting Intel Pentium
leaved or linear burst sequences
Separate processor and controller address strobes
Synchronous self-timed write
Asynchronous output enable
Single cycle chip deselect
CY7C1380D/CY7C1382D is available in JEDEC-standard
Pb-free 100-pin TQFP, Pb-free and non Pb-free 165-ball FBGA
package; CY7C1380F/CY7C1382F is available in
JEDEC-standard Pb-free 100-pin TQFP, Pb-free and non
Pb-free 119-ball BGA and 165-ball FBGA package
IEEE 1149.1 JTAG-Compatible Boundary Scan
ZZ sleep mode option
Selection Guide
Description
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
Notes
1. For best practices or recommendations, please refer to the Cypress application note AN1064, SRAM System Design Guidelines on www.cypress.com.
2. CE
CE
are for TQFP and 165 FBGA packages only. 119 BGA is offered only in 1 chip enable.
3,
2
Cypress Semiconductor Corporation
Document #: 38-05543 Rev. *F

Functional Description

The
SRAM integrates 524,288 x 36 and 1,048,576 x 18 SRAM cells
with advanced synchronous peripheral circuitry and a two-bit
counter for internal burst operation. All synchronous inputs are
gated by registers controlled by a positive edge triggered clock
input (CLK). The synchronous inputs include all addresses, all
data
depth-expansion chip enables (CE
inputs (ADSC, ADSP, and ADV), write enables (BW
and global write (GW). Asynchronous inputs include the output
enable (OE) and the ZZ pin.
Addresses and chip enables are registered at rising edge of
®
inter-
clock when address strobe processor (ADSP) or address strobe
controller (ADSC) are active. Subsequent burst addresses can
be internally generated as they are controlled by the advance pin
(ADV).
Address, data inputs, and write controls are registered on-chip
to initiate a self-timed write cycle.This part supports byte write
operations (see
for further details). Write cycles can be one to two or four bytes
wide as controlled by the byte write control inputs. GW when
active LOW causes all bytes to be written.
The
operates from a +3.3V core power supply while all outputs
operate with a +2.5 or +3.3V power supply. All inputs and outputs
are JEDEC-standard and JESD8-5-compatible.
250 MHz
2.6
350
70
198 Champion Court
CY7C1380D, CY7C1382D
CY7C1380F, CY7C1382F
18-Mbit (512K x 36/1M x 18)
Pipelined SRAM
CY7C1380D/CY7C1382D/CY7C1380F/CY7C1382F
inputs,
address-pipelining
Table 1
on page 6 and
CY7C1380D/CY7C1382D/CY7C1380F/CY7C1382F
200 MHz
167 MHz
3.0
3.4
300
275
70
70
,
San Jose
CA 95134-1709
[1]
chip
enable
(CE
),
1
[2]
and CE
), burst control
2
3
, and BWE),
X
"Truth Table"
on page 10
Unit
ns
mA
mA
408-943-2600
Revised January 12, 2009
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Summary of Contents for Cypress Semiconductor Perform CY7C1380D

  • Page 1: Functional Description

    Features Supports bus operation up to 250 MHz ■ Available speed grades are 250, 200, and 167 MHz ■ Registered inputs and outputs for pipelined operation ■ 3.3V core power supply ■ 2.5V or 3.3V I/O power supply ■ Fast clock-to-output times ■...
  • Page 2 Logic Block Diagram – CY7C1380D/CY7C1380F A0, A1, A ADDRESS REGISTER MODE ADSC ADSP BYTE WRITE REGISTER BYTE WRITE REGISTER BYTE WRITE REGISTER BYTE WRITE REGISTER ENABLE REGISTER SLEEP CONTROL Logic Block Diagram – CY7C1382D/CY7C1382F ADDRESS A0, A1, A REGISTER BURST COUNTER AND LOGIC ADSC...
  • Page 3: Pin Configurations

    CY7C1380D, CY7C1382D CY7C1380F, CY7C1382F Pin Configurations 100-Pin TQFP Pinout (3-Chip Enable) Figure 1. CY7C1380D, CY7C1380F(512K X 36) Figure 2. CY7C1382D, CY7C1382F (1M X 18) Document #: 38-05543 Rev. *F Page 3 of 34 [+] Feedback...
  • Page 4 119-Ball BGA Pinout NC/288M NC/144M NC/288M NC/144M NC/72M Document #: 38-05543 Rev. *F Figure 3. CY7C1380F (512K X 36) ADSP ADSC MODE NC/72M Figure 4. CY7C1382F (1M X 18) ADSP ADSC MODE NC/36M CY7C1380D, CY7C1382D CY7C1380F, CY7C1382F NC/576M NC/1G NC/36M NC/576M NC/1G Page 4 of 34...
  • Page 5 165-Ball FBGA Pinout (3-Chip Enable) NC/288M NC/144M NC/72M MODE NC/36M NC/288M NC/144M NC/72M MODE NC/36M Document #: 38-05543 Rev. *F Figure 5. CY7C1380D/CY7C1380F (512K x 36) Figure 6. CY7C1382D/CY7C1382F (1M x 18) CY7C1380D, CY7C1382D CY7C1380F, CY7C1382F ADSC NC/576M ADSP NC/1G ADSC A NC/576M ADSP...
  • Page 6 Table 1. Pin Definitions Name Input- Address inputs used to select one of the address locations. Sampled at the rising edge of Synchronous the CLK if ADSP or ADSC is active LOW, and CE are fed to the two-bit counter. . , BW Input- Byte write select inputs, active LOW.
  • Page 7 Table 1. Pin Definitions (continued) MODE Input-Static Selects burst order. When tied to GND selects linear burst sequence. When tied to V floating selects interleaved burst sequence. This is a strap pin and must remain static during device operation. Mode pin has an internal pull up. JTAG serial Serial data-out to the JTAG circuit.
  • Page 8: Functional Overview

    Functional Overview All synchronous inputs pass through input registers controlled by the rising edge of the clock. All data outputs pass through output registers controlled by the rising edge of the clock. Maximum access delay from the clock rise (t ) is 2.6 ns (250 MHz device).
  • Page 9 Burst Sequences CY7C1380D/CY7C1382D/CY7C1380F/CY7C1382F provides a two-bit wraparound counter, fed by A1: A0, that imple- ments an interleaved or a linear burst sequence. The interleaved burst sequence is designed specifically to support Intel Pentium applications. The linear burst sequence is designed to support processors that follow a linear burst sequence.
  • Page 10: Truth Table

    Truth Table The Truth Table for this data sheet follows. Operation Add. Used Deselect Cycle, Power Down None Deselect Cycle, Power Down None Deselect Cycle, Power Down None Deselect Cycle, Power Down None Deselect Cycle, Power Down None Sleep Mode, Power Down None READ Cycle, Begin Burst External...
  • Page 11 Truth Table for Read/Write [4, 9] Function (CY7C1380D/CY7C1380F) Read Read Write Byte A – (DQ and DQP Write Byte B – (DQ and DQP Write Bytes B, A Write Byte C – (DQ and DQP Write Bytes C, A Write Bytes C, B Write Bytes C, B, A Write Byte D –...
  • Page 12: Tap Controller State Diagram

    IEEE 1149.1 Serial Boundary Scan (JTAG) The CY7C1380D/CY7C1382D incorporates a serial boundary scan test access port (TAP).This part is fully compliant with 1149.1. The TAP operates using JEDEC-standard 3.3V or 2.5V I/O logic levels. The CY7C1380D/CY7C1382D contains a TAP controller, instruction register, boundary scan register, bypass register, and ID register.
  • Page 13 When the TAP controller is in the Capture-IR state, the two least significant bits are loaded with a binary ‘01’ pattern to enable fault isolation of the board-level serial test data path. Bypass Register To save time when serially shifting data through registers, it is sometimes advantageous to skip certain chips.
  • Page 14 when the EXTEST is entered as the current instruction. When HIGH, it enables the output buffers to drive the output bus. When LOW, this bit places the output bus into a High-Z condition. This bit can be set by entering the SAMPLE/PRELOAD or EXTEST command, and then shifting the desired bit into that cell, during the Shift-DR state.
  • Page 15 3.3V TAP AC Test Conditions Input pulse levels...V Input rise and fall times...1 ns Input timing reference levels..1.5V Output reference levels ..1.5V Test load termination supply voltage ..1.5V Figure 7. 3.3V TAP AC Output Load Equivalent 1.5V Z = 50 Ω...
  • Page 16: Identification Codes

    Identification Register Definitions CY7C1380D/CY7C1380F Instruction Field Revision Number (31:29) [13] Device Depth (28:24) Device Width (23:18) 119-BGA Device Width (23:18) 165-FBGA Cypress Device ID (17:12) Cypress JEDEC ID Code (11:1) ID Register Presence Indicator (0) Scan Register Sizes Register Name Instruction Bypass Boundary Scan Order (119-ball BGA package)
  • Page 17 119-Ball BGA Boundary Scan Order Bit # Ball ID Bit # Notes 14. Balls which are NC (No Connect) are pre-set LOW. 15. Bit# 85 is pre-set HIGH. Document #: 38-05543 Rev. *F CY7C1380D, CY7C1382D [14, 15] Ball ID Bit # Ball ID CY7C1380F, CY7C1382F Bit #...
  • Page 18 165-Ball BGA Boundary Scan Order Bit # Ball ID Note 16. Bit# 89 is pre-set HIGH. Document #: 38-05543 Rev. *F [14, 16] Bit # Ball ID CY7C1380D, CY7C1382D CY7C1380F, CY7C1382F Bit # Ball ID Internal Page 18 of 34 [+] Feedback...
  • Page 19: Maximum Ratings

    Maximum Ratings Exceeding the maximum ratings may impair the useful life of the device. For user guidelines, not tested. Storage Temperature ... –65°C to +150°C Ambient Temperature with Power Applied ... –55°C to +125°C Supply Voltage on V Relative to GND ...–0.3V to +4.6V Supply Voltage on V Relative to GND ...
  • Page 20: Thermal Resistance

    Capacitance [19] Parameter Description Input Capacitance Clock Input Capacitance Input/Output Capacitance Thermal Resistance [19] Parameter Description Θ Thermal Resistance (Junction to Ambient) Θ Thermal Resistance (Junction to Case) Document #: 38-05543 Rev. *F 100 TQFP Test Conditions Package = 25°C, f = 1 MHz, = 3.3V.
  • Page 21 3.3V I/O Test Load OUTPUT OUTPUT = 50Ω = 50Ω = 1.5V 2.5V I/O Test Load OUTPUT OUTPUT = 50Ω = 50Ω = 1.25V Note 19. Tested initially and after any design or process change that may affect these parameters. Document #: 38-05543 Rev.
  • Page 22: Switching Characteristics

    Switching Characteristics Over the Operating Range Description Parameter (Typical) to the first Access POWER Clock Clock Cycle Time Clock HIGH Clock LOW Output Times Data Output Valid After CLK Rise Data Output Hold After CLK Rise [23, 24, 25] Clock to Low-Z [23, 24, 25] Clock to High-Z OE LOW to Output Valid...
  • Page 23: Switching Waveforms

    Switching Waveforms t CYC ADSP t ADS t ADH ADSC t AS t AH ADDRESS t WES t WEH GW, BWE, t CES t CEH t CLZ Q(A1) Data Out (Q) High-Z t CO Single READ Note 26. On this diagram, when CE is LOW: CE is LOW, CE Document #: 38-05543 Rev.
  • Page 24 Switching Waveforms (continued) t CYC t CH t CL t ADS t ADH ADSP t ADS t ADH ADSC t AS t AH ADDRESS Byte write signals are ignored for first cycle when ADSP initiates burst BWE, t CES t CEH t DS t DH Data In (D)
  • Page 25 Switching Waveforms (continued) Figure 12. Read/Write Cycle Timing t CYC t CH t CL t ADS t ADH ADSP ADSC t AS t AH ADDRESS BWE, t CES t CEH t CO Data In (D) High-Z t OEHZ t CLZ Data Out (Q) Q(A1) Q(A2)
  • Page 26 Switching Waveforms (continued) SUPPLY ALL INPUTS (except ZZ) Outputs (Q) Notes 30. Device must be deselected when entering ZZ mode. See 31. DQs are in high-Z when exiting ZZ sleep mode. Document #: 38-05543 Rev. *F [30, 31] Figure 13. ZZ Mode Timing DDZZ High-Z DON’T CARE...
  • Page 27: Ordering Information

    Ordering Information The following table lists all speed, package and temperature range options. Please note that some options listed below may not be available for order entry. To verify the availability of a specific option, visit the Cypress website at to the product summary page at http://www.cypress.com/products, or contact your local sales representative for the status of availability of parts.
  • Page 28 Speed Package (MHz) Ordering Code Diagram CY7C1380D-200AXC 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Pb-Free CY7C1382D-200AXC CY7C1380F-200AXC CY7C1382F-200AXC CY7C1380F-200BGC 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) CY7C1382F-200BGC CY7C1380F-200BGXC 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) Pb-Free CY7C1382F-200BGXC CY7C1380D-200BZC 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm)
  • Page 29 Speed Package (MHz) Ordering Code Diagram CY7C1380D-167AXC 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Pb-Free CY7C1382D-167AXC CY7C1380F-167AXC CY7C1382F-167AXC CY7C1380F-167BGC 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) CY7C1382F-167BGC CY7C1380F-167BGXC 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) Pb-Free CY7C1382F-167BGXC CY7C1380D-167BZC 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm)
  • Page 30: Package Diagrams

    Package Diagrams Figure 14. 100-Pin Thin Plastic Quad Flat Pack (14 x 20 x 1.4 mm) (51-85050) R 0.08 MIN. 0° MIN. 0.20 MAX. 0.25 GAUGE PLANE R 0.08 MIN. 0°-7° 0.20 MAX. 0.60±0.15 0.20 MIN. 1.00 REF. DETAIL Document #: 38-05543 Rev. *F 16.00±0.20 14.00±0.10 0.30±0.08...
  • Page 31 CY7C1380D, CY7C1382D CY7C1380F, CY7C1382F Package Diagrams (continued) Figure 15. 119-Ball BGA (14 x 22 x 2.4 mm) (51-85115) 51-85115-*B Document #: 38-05543 Rev. *F Page 31 of 34 [+] Feedback...
  • Page 32 Package Diagrams (continued) Figure 16. 165-Ball FBGA (13 x 15 x 1.4 mm) (51-85180) 165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D TOP VIEW TOP VIEW PIN 1 CORNER PIN 1 CORNER 13.00±0.10 13.00±0.10 SEATING PLANE SEATING PLANE Document #: 38-05543 Rev. *F 0.15(4X) 0.15(4X) NOTES :...
  • Page 33 Document History Page Document Title: CY7C1380D/CY7C1382D/CY7C1380F/CY7C1382F, 18-Mbit (512K x 36/1M x 18) Pipelined SRAM Document Number: 38-05543 Submission Orig. of REV. ECN NO. Date Change 254515 See ECN 288531 See ECN 326078 See ECN 416321 See ECN 475009 See ECN 776456 See ECN 2648065...
  • Page 34 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at cypress.com/sales. Products PSoC Clocks & Buffers Wireless wireless.cypress.com Memories memory.cypress.com...

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