Cypress Semiconductor CY7C1381D Specification Sheet

Cypress flow-through sram specification sheet

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18-Mbit (512K x 36/1M x 18) Flow-Through SRAM
Features
• Supports 133 MHz bus operations
• 512K × 36 and 1M × 18 common IO
• 3.3V core power supply (V
• 2.5V or 3.3V IO supply (V
DDQ
• Fast clock-to-output time
— 6.5 ns (133 MHz version)
• Provides high performance 2-1-1-1 access rate
• User selectable burst counter supporting Intel
interleaved or linear burst sequences
• Separate processor and controller address strobes
• Synchronous self-timed write
• Asynchronous output enable
• CY7C1381D/CY7C1383D available in JEDEC-standard
Pb-free 100-pin TQFP, Pb-free and non Pb-free 165-ball
FBGA package. CY7C1381F/CY7C1383F available in
Pb-free and non Pb-free 119-ball BGA package
• IEEE 1149.1 JTAG-Compatible Boundary Scan
• ZZ sleep mode option
Selection Guide
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
Notes:
1. For best practices or recommendations, please refer to the Cypress application note AN1064, SRAM System Design Guidelines on www.cypress.com.
2. CE
CE
are for TQFP and 165 FBGA packages only. 119 BGA is offered only in 1 chip enable.
3,
2
Cypress Semiconductor Corporation
Document #: 38-05544 Rev. *F
)
DD
)
®
Pentium
133 MHz
6.5
210
70
198 Champion Court
CY7C1381D, CY7C1381F
CY7C1383D, CY7C1383F
Functional Description
The CY7C1381D/CY7C1383D/CY7C1381F/CY7C1383F is a
3.3V, 512K x 36 and 1M x 18 synchronous flow through
SRAMs,
designed
microprocessors with minimum glue logic. Maximum access
delay from clock rise is 6.5 ns (133 MHz version). A 2-bit
on-chip counter captures the first address in a burst and
increments the address automatically for the rest of the burst
access. All synchronous inputs are gated by registers
controlled by a positive edge triggered clock input (CLK). The
synchronous inputs include all addresses, all data inputs,
®
address pipelining chip enable (CE
enables (CE
and CE
2
3
and ADV), write enables (BW
(GW). Asynchronous inputs include the output enable (OE)
and the ZZ pin.
The
CY7C1381D/CY7C1383D/CY7C1381F/CY7C1383F
allows interleaved or linear burst sequences, selected by the
MODE input pin. A HIGH selects an interleaved burst
sequence, while a LOW selects a linear burst sequence. Burst
accesses can be initiated with the processor address strobe
(ADSP) or the cache controller address strobe (ADSC) inputs.
Address
advancement
advancement (ADV) input.
Addresses and chip enables are registered at rising edge of
clock when address strobe processor (ADSP) or address
strobe controller (ADSC) are active. Subsequent burst
addresses can be internally generated as controlled by the
advance pin (ADV).
The
CY7C1381D/CY7C1383D/CY7C1381F/CY7C1383F
operates from a +3.3V core power supply while all outputs
operate with a +2.5V or +3.3V supply. All inputs and outputs
are JEDEC-standard and JESD8-5-compatible.
100 MHz
8.5
175
70
,
San Jose
CA 95134-1709
[1]
to
interface
with
high-speed
), depth-expansion chip
1
[2]
), burst control inputs (ADSC, ADSP,
, and BWE), and global write
x
is controlled
by
the address
Unit
ns
mA
mA
408-943-2600
Revised Feburary 07, 2007
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Summary of Contents for Cypress Semiconductor CY7C1381D

  • Page 1 • Separate processor and controller address strobes • Synchronous self-timed write • Asynchronous output enable • CY7C1381D/CY7C1383D available in JEDEC-standard Pb-free 100-pin TQFP, Pb-free and non Pb-free 165-ball FBGA package. CY7C1381F/CY7C1383F available in Pb-free and non Pb-free 119-ball BGA package •...
  • Page 2 Logic Block Diagram – CY7C1381D/CY7C1381F A0, A1, A MODE ADSC ADSP BYTE BYTE WRITE REGISTER WRITE REGISTER WRITE REGISTER WRITE REGISTER BYTE WRITE REGISTER ENABLE REGISTER SLEEP Logic Block Diagram – CY7C1383D/CY7C1383F ADDRESS A0,A1,A REGISTER MODE ,DQP ,DQP ENABLE SLEEP...
  • Page 3: Pin Configurations

    Pin Configurations 100-pin TQFP Pinout (3 Chip Enable) /DNU CY7C1381D (512K x 36) Document #: 38-05544 Rev. *F CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F /DNU CY7C1383D (1M x 18) Page 3 of 29 [+] Feedback...
  • Page 4 NC/72M Document #: 38-05544 Rev. *F 119-Ball BGA Pinout CY7C1381F (512K x 36) ADSP ADSC MODE NC/72M CY7C1383F (1M x 18) ADSP ADSC MODE NC/36M CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F NC/576M NC/1G NC/36M NC/576M NC/1G Page 4 of 29 [+] Feedback...
  • Page 5 165-Ball FBGA Pinout (3 Chip Enable) NC/288M NC/144M NC/72M MODE NC/36M NC/288M NC/144M NC/72M MODE NC/36M Document #: 38-05544 Rev. *F CY7C1381D (512K x 36) CY7C1383D (1M x 18) CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F ADSC ADSP NC/576M NC/1G ADSC ADSP NC/576M NC/1G...
  • Page 6: Pin Definitions

    When ADSP and ADSC are both [1:0] are also loaded into the burst counter. When ADSP and ADSC are both [1:0] and DQP is controlled by BW correspondingly. CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F , CE , and CE are sampled active. and BWE). [A:D] is HIGH.
  • Page 7: Functional Overview

    Byte writes are allowed. All IOs are tri-stated during a byte write. As this is a common IO device, the asynchronous OE input signal must be CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F through a pull up .
  • Page 8 ZZ > V – 0.2V ZZ > V – 0.2V ZZ < 0.2V This parameter is sampled This parameter is sampled CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F , CE , CE , ADSP, and ADSC must after the ZZ input ZZREC Second...
  • Page 9: Truth Table

    8. OE is asynchronous and is not sampled with the clock rise. It is masked internally during write cycles. During a read cycle all data bits are tri-state when OE is inactive or when the device is deselected, and all data bits behave as output when OE is active (LOW). Document #: 38-05544 Rev. *F ADSP ADSC CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F ADV WRITE L-H Tri-State L-H Tri-State...
  • Page 10 Truth Table for Read/Write [4, 9] Function (CY7C1381D/CY7C1381F) Read Read Write Byte A (DQ , DQP Write Byte B(DQ , DQP Write Bytes A, B (DQ , DQ , DQP , DQP Write Byte C (DQ , DQP Write Bytes C, A (DQ...
  • Page 11 When the TAP controller is in the Capture-IR state, the two least significant bits are loaded with a binary ‘01’ pattern to allow for fault isolation of the board level serial test path. CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F TAP Controller Block TAP Controller State Diagram.)
  • Page 12 When this scan cell, called the “extest output bus tri-state,” is latched into the preload register during the Update-DR state in the TAP controller, it will directly control the state of the output CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F ). The SRAM clock input might not be...
  • Page 13 Do not use these instructions. t TH t CYC t TMSS t TMSH t TDIS t TDIH t TDOV t TDOX DON’T CARE UNDEFINED Description = 1 ns. CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F Unit Page 13 of 29 [+] Feedback...
  • Page 14 = 2.5V = 100 µA = 3.3V = 2.5V = 3.3V = 2.5V = 3.3V = 2.5V GND < V < V CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F to 2.5V 1.25V 50Ω Z = 50 Ω 20pF Unit + 0.3 + 0.3 –0.3...
  • Page 15: Identification Codes

    101001 000001 000001 100101 010101 00000110100 00000110100 Bit Size (×36) Description CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F Description Describes the version number. Reserved for internal use. Defines the memory type and architecture. Defines the memory type and architecture. Defines the width and density.
  • Page 16 Ball ID Bit # Notes: 14. Balls which are NC (No Connect) are pre-set LOW. 15. Bit# 85 is pre-set HIGH. Document #: 38-05544 Rev. *F CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F [14, 15] Ball ID Bit # Ball ID Bit #...
  • Page 17 165-Ball BGA Boundary Scan Order Bit # Ball ID Note: 16. Bit# 89 is pre-set HIGH. Document #: 38-05544 Rev. *F CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F [14, 16] Bit # Ball ID Bit # Ball ID Internal Page 17 of 29...
  • Page 18: Maximum Ratings

    – 0.3V or V /2), undershoot: V (AC) > –2V (pulse width less than t (min) within 200 ms. During this time V < V and V CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F + 0.5V Ambient 3.3V –5%/+10% 2.5V – 5% to V Unit 3.135...
  • Page 19: Thermal Resistance

    R = 351Ω INCLUDING JIG AND SCOPE R = 1667Ω 2.5V OUTPUT 5 pF R = 1538Ω INCLUDING JIG AND SCOPE CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F 119 BGA 165 FBGA Package Package Unit 119 BGA 165 FBGA Package Package Unit 23.8 20.7...
  • Page 20: Switching Characteristics

    AC Test Loads and Waveforms on page and t is less than t to eliminate bus contention between SRAMs when sharing the same OELZ CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F 100 MHz Unit (minimum) initially, before a read or write operation 19. Transition is measured ± 200...
  • Page 21: Timing Diagrams

    OELZ t DOH Q(A2) Q(A2 + 1) Q(A2 + 2) BURST READ DON’T CARE UNDEFINED CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F Deselect Cycle t CHZ Q(A2 + 3) Q(A2) Q(A2 + 1) Q(A2 + 2) Burst wraps around to its initial state...
  • Page 22 ADSC extends burst ADV suspends burst D(A2) D(A2 + 1) D(A2 + 1) D(A2 + 2) BURST WRITE DON’T CARE UNDEFINED LOW. CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F t ADS t ADH t WES t WEH t ADVS t ADVH D(A2 + 3) D(A3)
  • Page 23 29. GW is HIGH. Document #: 38-05544 Rev. *F t DS t DH t OELZ D(A3) t CDV Q(A4) Q(A4+1) Single WRITE BURST READ DON’T CARE UNDEFINED CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F D(A5) D(A6) Q(A4+2) Q(A4+3) Back-to-Back WRITEs Page 23 of 29 [+] Feedback...
  • Page 24 Outputs (Q) Notes: 30. Device must be deselected when entering ZZ mode. See 31. DQs are in high-Z when exiting ZZ sleep mode. Document #: 38-05544 Rev. *F CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F t RZZI DESELECT or READ Only High-Z DON’T CARE...
  • Page 25: Ordering Information

    51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) CY7C1383D-100BZI CY7C1381D-100BZXI 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free CY7C1383D-100BZXI Document #: 38-05544 Rev. *F CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F Part and Package Type Operating Range Commercial...
  • Page 26: Package Diagrams

    2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 3. DIMENSIONS IN MILLIMETERS CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F 1.40±0.05 12°±1°...
  • Page 27 Package Diagrams (continued) Figure 2. 119-ball BGA (14 x 22 x 2.4 mm) (51-85115) Document #: 38-05544 Rev. *F CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F 51-85115-*B Page 27 of 29 [+] Feedback...
  • Page 28 JEDEC REFERENCE : MO-216 / DESIGN 4.6C PACKAGE WEIGHT : 0.475g PACKAGE CODE : BB0AC JEDEC REFERENCE : MO-216 / DESIGN 4.6C PACKAGE CODE : BB0AC CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F BOTTOM VIEW PIN 1 CORNER BOTTOM VIEW PIN 1 CORNER Ø0.05 M C...
  • Page 29 Document History Page Document Title: CY7C1381D/CY7C1383D/CY7C1381F/CY7C1383F 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM Document Number: 38-05544 Orig. of REV. ECN NO. Issue Date Change 254518 See ECN 288531 See ECN 326078 See ECN 351895 See ECN 416321 See ECN...

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