Cypress Semiconductor CY7C1350G Specification Sheet

Cypress 4-mbit (128k x 36) pipelined sram with nobl architecture specification sheet

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Features
• Pin compatible and functionally equivalent to ZBT™
devices
• Internally self-timed output buffer control to eliminate
the need to use OE
• Byte Write capability
• 128K x 36 common I/O architecture
• 3.3V power supply (V
)
DD
• 2.5V/3.3V I/O power supply (V
• Fast clock-to-output times
— 2.6 ns (for 250-MHz device)
• Clock Enable (CEN) pin to suspend operation
• Synchronous self-timed writes
• Asynchronous output enable (OE)
• Available in lead-free 100-Pin TQFP package, lead-free
and non-lead-free 119-Ball BGA package
• Burst Capability—linear or interleaved burst order
• "ZZ" Sleep mode option
Logic Block Diagram
A0, A1, A
MODE
CLK
C
CEN
WRITE ADDRESS
ADV/LD
BW
A
BW
B
BW
C
BW
D
WE
OE
CE1
CE2
CE3
ZZ
Note:
1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05524 Rev. *F
4-Mbit (128K x 36) Pipelined SRAM
)
DDQ
ADDRESS
REGISTER 0
A1
D1
A0
BURST
D0
LOGIC
ADV/LD
C
WRITE ADDRESS
REGISTER 1
REGISTER 2
WRITE REGISTRY
AND DATA COHERENCY
CONTROL LOGIC
READ LOGIC
SLEEP
CONTROL
198 Champion Court
with NoBL™ Architecture
Functional Description
The CY7C1350G is a 3.3V, 128K x 36 synchronous-pipelined
Burst SRAM designed specifically to support unlimited true
back-to-back Read/Write operations without the insertion of
wait states. The CY7C1350G is equipped with the advanced
No Bus Latency™ (NoBL™) logic required to enable consec-
utive Read/Write operations with data being transferred on
every clock cycle. This feature dramatically improves the
throughput of the SRAM, especially in systems that require
frequent Write/Read transitions.
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. All data outputs pass through
output registers controlled by the rising edge of the clock. The
clock input is qualified by the Clock Enable (CEN) signal,
which, when deasserted, suspends operation and extends the
previous clock cycle. Maximum access delay from the clock
rise is 2.6 ns (250-MHz device)
Write operations are controlled by the four Byte Write Select
(BW
) and a Write Enable (WE) input. All writes are
[A:D]
conducted with on-chip synchronous self-timed write circuitry.
Three synchronous Chip Enables (CE
asynchronous Output Enable (OE) provide for easy bank
selection and output tri-state control. In order to avoid bus
contention, the output drivers are synchronously tri-stated
during the data portion of a write sequence.
A1'
Q1
A0'
Q0
S
E
N
S
E
MEMORY
WRITE
ARRAY
A
DRIVERS
M
P
S
INPUT
E
REGISTER 1
,
San Jose
CA 95134-1709
CY7C1350G
[1]
, CE
, CE
) and an
1
2
3
O
D
U
A
T
P
T
U
A
T
S
B
DQs
U
T
DQP
A
F
E
DQP
B
F
E
DQP
E
C
R
R
DQP
D
I
S
N
E
E
G
INPUT
E
REGISTER 0
408-943-2600
Revised July 5, 2006
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Summary of Contents for Cypress Semiconductor CY7C1350G

  • Page 1 4-Mbit (128K x 36) Pipelined SRAM with NoBL™ Architecture Functional Description The CY7C1350G is a 3.3V, 128K x 36 synchronous-pipelined Burst SRAM designed specifically to support unlimited true back-to-back Read/Write operations without the insertion of wait states. The CY7C1350G is equipped with the advanced No Bus Latency™...
  • Page 2: Selection Guide

    Maximum CMOS Standby Current Pin Configurations BYTE C BYTE D Document #: 38-05524 Rev. *F 250 MHz 200 MHz 166 MHz 100-Pin TQFP Pinout CY7C1350G CY7C1350G 133 MHz 100 MHz Unit BYTE B BYTE A Page 2 of 15 [+] Feedback...
  • Page 3 Document #: 38-05524 Rev. *F 119-Ball BGA Pinout NC/18M ADV/LD NC/9M MODE NC/72M Description are fed to the two-bit burst counter. [1:0] to select/deselect the device. to select/deselect the device. to select/deselect the device. CY7C1350G NC/288M NC/36M Page 3 of 15 [+] Feedback...
  • Page 4: Functional Overview

    Burst Read Accesses The CY7C1350G has an on-chip burst counter that allows the user the ability to supply a single address and conduct up to four Reads without reasserting the address inputs. ADV/LD...
  • Page 5 OE. Burst Write Accesses The CY7C1350G has an on-chip burst counter that allows the user the ability to supply a single address and conduct up to four Write operations without reasserting the address inputs.
  • Page 6: Truth Table

    ZZ > V − 0.2V ZZ > V ZZ < 0.2V This parameter is sampled This parameter is sampled is valid. Appropriate write will be done on which byte write is active. CY7C1350G OE CEN Tri-State Tri-State — Tri-State Min.
  • Page 7: Maximum Ratings

    – 0.3V, f = 0 /2), undershoot: V (AC)> –2V (Pulse width less than t (min.) within 200 ms. During this time V < V and V CY7C1350G + 0.5V Ambient Temperature (T 0°C to +70°C 3.3V – 5% 2.5V – 5%...
  • Page 8: Thermal Resistance

    ≤ 1 ns INCLUDING JIG AND SCOPE R = 1667Ω 2.5V OUTPUT 5 pF R =1538Ω ≤ 1 ns INCLUDING JIG AND SCOPE CY7C1350G Min. Max. Unit 119 BGA 100 TQFP Max. Max. Unit 100 TQFP 119 BGA Package Package Unit 30.32...
  • Page 9: Switching Characteristics

    V and t is less than t to eliminate bus contention between SRAMs when sharing the same OELZ = 2.5V. CY7C1350G –166 –133 –100 Max. Min. Max. Min. Max. Unit minimum initially before a Read or Write operation...
  • Page 10: Switching Waveforms

    Q(A3) OEHZ READ READ BURST Q(A3) Q(A4) READ Q(A4+1) DON’T CARE UNDEFINED is LOW. When CE is HIGH, CE is HIGH or CE CY7C1350G Q(A4) Q(A4+1) D(A5) Q(A6) OELZ WRITE READ WRITE DESELECT D(A5) Q(A6) D(A7) is LOW or CE is HIGH.
  • Page 11 Document #: 38-05524 Rev. *F D(A1) Q(A2) Q(A3) STALL READ WRITE STALL Q(A3) D(A4) DON’T CARE UNDEFINED High-Z DON’T CARE CY7C1350G D(A4) Q(A5) READ DESELECT CONTINUE Q(A5) DESELECT t ZZREC t RZZI DESELECT or READ Only Page 11 of 15 [+] Feedback...
  • Page 12: Ordering Information

    Speed Package (MHz) Ordering Code Diagram CY7C1350G-100AXC 51-85050 100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free CY7C1350G-100BGC 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) CY7C1350G-100BGXC CY7C1350G-100AXI 51-85050 100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free CY7C1350G-100BGI 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm)
  • Page 13: Package Diagrams

    2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 3. DIMENSIONS IN MILLIMETERS CY7C1350G 1.40±0.05 12°±1° SEE DETAIL (8X) 0.20 MAX.
  • Page 14 Cypress against all charges. 119-Ball BGA (14 x 22 x 2.4 mm) (51-85115) Ø1.00(3X) REF. 0.15(4X) CY7C1350G Ø0.05 M C Ø0.25 M C A B Ø0.75±0.15(119X) 1.27...
  • Page 15 Document History Page Document Title: CY7C1350G 4-Mbit (128K x 36) Pipelined SRAM with NoBL™ Architecture Document Number: 38-05524 Issue Orig. of REV. ECN NO. Date Change Description of Change 224380 See ECN 276690 See ECN 332895 See ECN 351194 See ECN...

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