Cypress Semiconductor CY7C1360C Specification Sheet

Cypress Semiconductor CY7C1360C Specification Sheet

9-mbit (256k x 36/512k x 18) pipelined sram

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Features
• Supports bus operation up to 250 MHz
• Available speed grades are 250, 200, and 166 MHz
• Registered inputs and outputs for pipelined operation
• 3.3V core power supply (V
• 2.5V/3.3V I/O operation (V
• Fast clock-to-output times
— 2.8 ns (for 250-MHz device)
• Provide high-performance 3-1-1-1 access rate
• User-selectable burst counter supporting Intel
®
Pentium
interleaved or linear burst sequences
• Separate processor and controller address strobes
• Synchronous self-timed writes
• Asynchronous output enable
• Single Cycle Chip Deselect
• Available in lead-free 100-Pin TQFP package, lead-free
and non lead-free 119-Ball BGA package and 165-Ball
FBGA package
• TQFP Available with 3-Chip Enable and 2-Chip Enable
• IEEE 1149.1 JTAG-Compatible Boundary Scan
Logic Block Diagram – CY7C1362C (512K x 18)
ADDRESS
A0, A1, A
REGISTER
MODE
ADV
CLK
ADSC
ADSP
DQ
WRITE REGISTER
BW
B
DQ
BW
WRITE REGISTER
A
BWE
GW
ENABLE
CE
1
REGISTER
CE2
CE3
OE
SLEEP
ZZ
CONTROL
Notes:
1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.
2. CE
is for A version of TQFP (3 Chip Enable option) and 165 FBGA package only. 119 BGA is offered only in 2 Chip Enable.
3
Cypress Semiconductor Corporation
Document #: 38-05540 Rev. *H
9-Mbit (256K x 36/512K x 18) Pipelined SRAM
)
DD
)
DDQ
®
A[1:0]
2
Q1
BURST
COUNTER AND
LOGIC
CLR
Q0
DQP
B,
B
DQP
A,
A
PIPELINED
ENABLE
198 Champion Court

Functional Description

The CY7C1360C/CY7C1362C SRAM integrates 256K x 36
and 512K x 18 SRAM cells with advanced synchronous
peripheral circuitry and a two-bit counter for internal burst
operation. All synchronous inputs are gated by registers
controlled by a positive-edge-triggered Clock Input (CLK). The
synchronous inputs include all addresses, all data inputs,
address-pipelining Chip Enable (CE
[2]
Enables (CE
and CE
2
3
and ADV), Write Enables (BW
(GW). Asynchronous inputs include the Output Enable (OE)
and the ZZ pin.
Addresses and chip enables are registered at rising edge of
clock when either Address Strobe Processor (ADSP) or
Address Strobe Controller (ADSC) are active. Subsequent
burst addresses can be internally generated as controlled by
the Advance pin (ADV).
Address, data inputs, and write controls are registered on-chip
to initiate a self-timed Write cycle.This part supports Byte Write
operations (see Pin Descriptions and Truth Table for further
details). Write cycles can be one to two or four bytes wide as
controlled by the Byte Write control inputs. GW when active
LOW cause s all bytes to be written.
The CY7C1360C/CY7C1362C operates from a +3.3V core
power supply while all outputs may operate with either a +2.5
or +3.3V supply. All inputs and outputs are JEDEC-standard
JESD8-5-compatible.
DQ
DQP
B,
B
WRITE DRIVER
SENSE
MEMORY
AMPS
ARRAY
DQ
DQP
A,
A
WRITE DRIVER
,
San Jose
CA 95134-1709
CY7C1360C
CY7C1362C
[1]
), depth-expansion Chip
1
), Burst Control inputs (ADSC, ADSP,
, and BWE), and Global Write
X
OUTPUT
OUTPUT
BUFFERS
REGISTERS
E
INPUT
REGISTERS
408-943-2600
Revised September 14, 2006
DQs
DQP
A
DQP
B
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Summary of Contents for Cypress Semiconductor CY7C1360C

  • Page 1: Functional Description

    Cypress Semiconductor Corporation Document #: 38-05540 Rev. *H Functional Description The CY7C1360C/CY7C1362C SRAM integrates 256K x 36 and 512K x 18 SRAM cells with advanced synchronous peripheral circuitry and a two-bit counter for internal burst operation. All synchronous inputs are gated by registers controlled by a positive-edge-triggered Clock Input (CLK).
  • Page 2: Selection Guide

    Logic Block Diagram – CY7C1360C (256K x 36) A0, A1, A ADDRESS REGISTER MODE ADSC ADSP BYTE WRITE REGISTER BYTE WRITE REGISTER BYTE WRITE REGISTER BYTE WRITE REGISTER ENABLE REGISTER SLEEP CONTROL Selection Guide Maximum Access Time Maximum Operating Current Maximum CMOS Standby Current Document #: 38-05540 Rev.
  • Page 3: Pin Configurations

    Pin Configurations 100-Pin TQFP Pinout (3 Chip Enables) (A Version) CY7C1360C (256K X 36) Document #: 38-05540 Rev. *H CY7C1362C (512K x 18) CY7C1360C CY7C1362C Page 3 of 31 [+] Feedback...
  • Page 4 Pin Configurations (continued) 100-Pin TQFP Pinout (2 Chip Enables) (AJ Version) CY7C1360C (256K X 36) Document #: 38-05540 Rev. *H CY7C1362C (512K x 18) CY7C1360C CY7C1362C Page 4 of 31 [+] Feedback...
  • Page 5 Pin Configurations (continued) 119-Ball BGA Pinout (2 Chip Enables with JTAG) NC/288M NC/144M NC/288M NC/144M NC/72M Document #: 38-05540 Rev. *H CY7C1360C (256K x 36) ADSP ADSC MODE NC/72M CY7C1362C (512K x 18) ADSP ADSC MODE NC/36M CY7C1360C CY7C1362C NC/576M...
  • Page 6 165-Ball FBGA Pinout (3 Chip Enable with JTAG) NC/288M NC/144M NC/72M MODE NC/36M NC/288M NC/144M NC/72M MODE NC/36M Document #: 38-05540 Rev. *H CY7C1360C (256K x 36) NC/18M CY7C1362C (512K x 18) NC/18M CY7C1360C CY7C1362C ADSC NC/576M ADSP NC/1G ADSC ADSP...
  • Page 7: Pin Definitions

    Not available for AJ package version. Not is assumed active throughout this document for is sampled only when a new external address is loaded. is deasserted HIGH. are placed in a tri-state condition. CY7C1360C CY7C1362C , CE , and CE are sampled active. A and BWE).
  • Page 8: Functional Overview

    , CE ) and an operations. Because the CY7C1360C/CY7C1362C is a common I/O device, the Output Enable (OE) must be deasserted HIGH before presenting data to the DQs inputs. Doing so will tri-state the output drivers. As a safety precaution, DQs are automati- cally tri-stated whenever a Write cycle is detected, regardless of the state of OE.
  • Page 9 A synchronous self-timed Write mechanism has been provided to simplify the Write operations. Because the CY7C1360C/CY7C1362C is a common I/O device, the Output Enable (OE) must be deasserted HIGH before presenting data to the DQs inputs. Doing so will tri-state the output drivers.
  • Page 10: Truth Table

    READ Cycle, Suspend Burst Current WRITE Cycle, Suspend Burst Current WRITE Cycle, Suspend Burst Current Partial Truth Table for Read/Write Function (CY7C1360C) Read Read Write Byte A – (DQ and DQP Write Byte B – (DQ and DQP Write Bytes B, A Write Byte C –...
  • Page 11 Write All Bytes Write All Bytes IEEE 1149.1 Serial Boundary Scan (JTAG) The CY7C1360C/CY7C1362C incorporates a serial boundary scan test access port (TAP) in the BGA package only. The TQFP package does not offer this functionality. This part operates in accordance with IEEE Standard 1149.1-1900, but doesn’t have the set of functions required for full 1149.1...
  • Page 12 When an EXTEST instruction is loaded into the instruction register, the SRAM responds as if a SAMPLE/PRELOAD instruction has been loaded. There is one difference between instructions. instruction, EXTEST places the SRAM outputs in a High-Z state. CY7C1360C CY7C1362C PRELOAD portion Unlike SAMPLE/PRELOAD...
  • Page 13 Do not use these instructions. t TH t CYC t TMSS t TMSH t TDIS t TDIH t TDOV t TDOX DON’T CARE UNDEFINED CY7C1360C CY7C1362C ). The SRAM clock input might not be Page 13 of 31 [+] Feedback...
  • Page 14 = 3.3V = –1.0 mA = 2.5V = –100 µA = 3.3V = 2.5V = 8.0 mA = 3.3V = 8.0 mA = 2.5V = 1 ns. CY7C1360C CY7C1362C Min. Max. Unit to 2.5V 1.25V 50Ω Z = 50Ω 20pF Min.
  • Page 15 Conditions = 100 µA = 3.3V = 2.5V = 3.3V = 2.5V = 3.3V = 2.5V GND < V < V CY7C1360C CY7C1362C (256KX36) (512KX18) Describes the version number 01011 01011 Reserved for Internal Use 101000 101000 Defines memory type and architecture...
  • Page 16 165-ball FBGA Boundary Scan Order CY7C1360C (256K x 36) Signal Bit# ball ID Name Bit# ball ID ADSC ADSP Internal Document #: 38-05540 Rev. *H Signal Name Bit# ball ID MODE Internal Internal Internal Internal Internal Internal Internal Internal Internal...
  • Page 17 119-ball BGA Boundary Scan Order CY7C1360C (256K x 36) Signal Bit# ball ID Name Bit# ball ID ADSC ADSP Internal Internal Document #: 38-05540 Rev. *H CY7C1362C (512K x 18) Signal Signal Name Bit# ball ID Name ADSC ADSP MODE...
  • Page 18: Maximum Ratings

    , f = 0 /2), undershoot: V (AC) > –2V (Pulse width less than t (min.) within 200 ms. During this time V < V and V CY7C1360C CY7C1362C Ambient Temperature 0°C to +70°C 3.3V – 2.5V – 5% to 5%/+10% Min.
  • Page 19 5 pF R = 351Ω INCLUDING JIG AND SCOPE R = 1667Ω 2.5V OUTPUT 5 pF R =1538Ω INCLUDING JIG AND SCOPE CY7C1360C CY7C1362C 119 BGA 165 FBGA Max. Max. Max. Unit 119 BGA 165 FBGA Package Package Unit 34.1 16.8...
  • Page 20: Switching Characteristics

    [20, 21, 22] = 2.5V. is the time that the power needs to be supplied above V and t is less than t to eliminate bus contention between SRAMs when sharing the same OELZ CY7C1360C CY7C1362C –200 –166 Min. Max. Min.
  • Page 21: Switching Waveforms

    DOH Q(A2) Q(A2 + 1) Q(A2 + 2) BURST READ DON’T CARE UNDEFINED is HIGH and CE is LOW. When CE is HIGH: CE CY7C1360C CY7C1362C Burst continued with new base address Deselect cycle t CHZ Q(A2 + 3) Q(A2)
  • Page 22 WEH ADV suspends burst D(A2) D(A2 + 1) D(A2 + 1) D(A2 + 2) BURST WRITE DON’T CARE UNDEFINED LOW. CY7C1360C CY7C1362C ADSC extends burst t ADS t ADH t WES t WEH ADVS ADVH D(A2 + 3) D(A3)
  • Page 23 26. GW is HIGH. Document #: 38-05540 Rev. *H t WES t WEH t DS t DH t OELZ D(A3) Q(A4) Q(A4+1) Single WRITE BURST READ DON’T CARE UNDEFINED CY7C1360C CY7C1362C D(A5) D(A6) Q(A4+2) Q(A4+3) Back-to-Back WRITEs Page 23 of 31 [+] Feedback...
  • Page 24 27. Device must be deselected when entering ZZ mode. See Cycle Descriptions table for all possible signal conditions to deselect the device. 28. DQs are in High-Z when exiting ZZ sleep mode. Document #: 38-05540 Rev. *H ZZREC t RZZI DESELECT or READ Only High-Z DON’T CARE CY7C1360C CY7C1362C Page 24 of 31 [+] Feedback...
  • Page 25: Ordering Information

    CY7C1360C-166BGC 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) CY7C1362C-166BGC CY7C1360C-166BGXC 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) Lead-Free CY7C1362C-166BGXC CY7C1360C-166BZC 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm)
  • Page 26 CY7C1360C-200BGC 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) CY7C1362C-200BGC CY7C1360C-200BGXC 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) Lead-Free CY7C1362C-200BGXC CY7C1360C-200BZC 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm)
  • Page 27 CY7C1360C-250BGC 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) CY7C1362C-250BGC CY7C1360C-250BGXC 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) Lead-Free CY7C1362C-250BGXC CY7C1360C-250BZC 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm)
  • Page 28: Package Diagrams

    2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 3. DIMENSIONS IN MILLIMETERS CY7C1360C CY7C1362C 1.40±0.05 12°±1°...
  • Page 29 A1 CORNER 0.70 REF. 12.00 30° TYP. SEATING PLANE Document #: 38-05540 Rev. *H 119-Ball PBGA (14 x 22 x 2.4 mm) (51-85115) Ø1.00(3X) REF. 0.15(4X) CY7C1360C CY7C1362C Ø0.05 M C Ø0.25 M C A B Ø0.75±0.15(119X) 1.27 3.81 7.62 14.00±0.20...
  • Page 30 SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD) JEDEC REFERENCE : MO-216 / DESIGN 4.6C PACKAGE WEIGHT : 0.475g PACKAGE CODE : BB0AC JEDEC REFERENCE : MO-216 / DESIGN 4.6C PACKAGE CODE : BB0AC CY7C1360C CY7C1362C BOTTOM VIEW PIN 1 CORNER BOTTOM VIEW PIN 1 CORNER Ø0.05 M C...
  • Page 31 Document History Page Document Title: CY7C1360C/CY7C1362C 9-Mbit (256K x 36/512K x 18) Pipelined SRAM Document Number: 38-05540 REV. ECN NO. Issue Date 241690 See ECN 278130 See ECN 248929 See ECN 323636 See ECN 332879 See ECN 357258 See ECN...

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