Cypress Semiconductor CY7C1386DV25 Specification Sheet

18-mbit (512k x 36/1m x 18) pipelined dcd sync sram

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18-Mbit (512K x 36/1M x 18) Pipelined DCD Sync SRAM
Features
• Supports bus operation up to 250 MHz
• Available speed grades are 250, 200, and 167 MHz
• Registered inputs and outputs for pipelined operation
• Optimal for performance (Double-Cycle deselect)
• Depth expansion without wait state
• 2.5V + 5% power supply (V
• Fast clock-to-output times, 2.6 ns (for 250 MHz device)
• Provides high-performance 3-1-1-1 access rate
• User selectable burst counter supporting Intel
interleaved or linear burst sequences
• Separate processor and controller address strobes
• Synchronous self timed writes
• Asynchronous output enable
• CY7C1386DV25/CY7C1387DV25 available in
JEDEC-standard Pb-free 100-pin TQFP, Pb-free and non
Pb-free 165-ball FBGA package.
CY7C1386FV25/CY7C1387FV25 available in Pb-free and
non Pb-free 119-ball BGA package
• IEEE 1149.1 JTAG-Compatible Boundary Scan
• ZZ sleep mode option
Selection Guide
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
Notes
1. For best practices or recommendations, please refer to the Cypress application note AN1064, SRAM System Design Guidelines on www.cypress.com.
2. CE
CE
are for TQFP and 165 FBGA packages only. 119 BGA is offered only in 1 chip enable.
3,
2
Cypress Semiconductor Corporation
Document Number: 38-05548 Rev. *E
)
DD
®
®
Pentium
250 MHz
198 Champion Court
CY7C1386DV25, CY7C1386FV25
CY7C1387DV25, CY7C1387FV25
Functional Description
The
CY7C1386DV25/CY7C1387DV25/CY7C1386FV25/
CY7C1387FV25 SRAM integrates 512K x 36 and 1M x 18
SRAM cells with advanced synchronous peripheral circuitry
and a two-bit counter for internal burst operation. All
synchronous inputs are gated by registers controlled by a
positive edge triggered clock input (CLK). The synchronous
inputs include all addresses, all data inputs, address-pipelining
chip enable (CE
), depth expansion chip enables (CE
1
[2]
CE
), burst control inputs (ADSC, ADSP, and ADV), write
3
enables (BW
, and BWE), and global write (GW).
X
Asynchronous inputs include the output enable (OE) and the
ZZ pin.
Addresses and chip enables are registered at rising edge of
clock when either address strobe processor (ADSP) or
address strobe controller (ADSC) are active. Subsequent
burst addresses can be internally generated as controlled by
the advance pin (ADV).
Address, data inputs, and write controls are registered on-chip
to initiate a self timed write cycle.This part supports byte write
operations (see
Pin Definitions on page 6
5, 6, 7, 8, 9]
on page 9
for further details). Write cycles can be
one to four bytes wide as controlled by the byte write control
inputs. GW active LOW causes all bytes to be written. This
device incorporates an additional pipelined enable register
which delays turning off the output buffers an additional cycle
when a deselect is executed.This feature allows depth
expansion without penalizing system performance.
The
CY7C1386DV25/CY7C1387DV25/CY7C1386FV25/
CY7C1387FV25 operates from a +2.5V power supply. All
inputs
and
outputs
JESD8-5-compatible.
200 MHz
2.6
3.0
350
300
70
70
,
San Jose
CA 95134-1709
[1]
and
2
and
Truth Table
are
JEDEC-standard
and
167 MHz
Unit
3.4
ns
275
mA
70
mA
408-943-2600
Revised Feburary 15, 2007
[4,
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Summary of Contents for Cypress Semiconductor CY7C1386DV25

  • Page 1 • Separate processor and controller address strobes • Synchronous self timed writes • Asynchronous output enable • CY7C1386DV25/CY7C1387DV25 available in JEDEC-standard Pb-free 100-pin TQFP, Pb-free and non Pb-free 165-ball FBGA package. CY7C1386FV25/CY7C1387FV25 available in Pb-free and non Pb-free 119-ball BGA package •...
  • Page 2 Logic Block Diagram – CY7C1386DV25/CY7C1386FV25 ADDRESS A0,A1,A REGISTER MODE ADSC ADSP BYTE WRITE REGISTER ,DQP BYTE WRITE REGISTER ,DQP BYTE WRITE REGISTER BYTE WRITE REGISTER ENABLE REGISTER CONTROL Logic Block Diagram – CY7C1387DV25/CY7C1387FV25 ADDRESS A0, A1, A REGISTER MODE BURST...
  • Page 3: Pin Configurations

    Pin Configurations CY7C1386DV25 (512K X 36) Document Number: 38-05548 Rev. *E CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 100-pin TQFP Pinout (3 Chip Enables) CY7C1387DV25 (1M x 18) Page 3 of 30 [+] Feedback...
  • Page 4 Pin Configurations (continued) NC/288M NC/144M NC/288M NC/144M NC/72M Document Number: 38-05548 Rev. *E CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 119-Ball BGA (1 Chip Enable) CY7C1386FV25 (512K x 36) ADSP ADSC MODE NC/72M CY7C1387FV25 (1M x 18) ADSP ADSC MODE NC/36M NC/576M NC/1G...
  • Page 5 NC/36M NC/288M NC/144M NC/72M MODE NC/36M Document Number: 38-05548 Rev. *E CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 165-Ball FBGA Pinout (3 Chip Enable) CY7C1386DV25 (512K x 36) CY7C1387DV25 (1M x 18) ‘V ADSC NC/576M ADSP NC/1G ADSC ADSP NC/576M NC/1G Page 5 of 30...
  • Page 6: Pin Definitions

    DQs, DQPs Synchronous Power Supply Document Number: 38-05548 Rev. *E CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 Description Address inputs used to select one of the address locations. Sampled at the rising edge of the CLK if ADSP or ADSC is active LOW, and CE are sampled active.
  • Page 7: Functional Overview

    (OE) provide for easy bank selection and output tri-state control. ADSP is ignored if CE is HIGH. Document Number: 38-05548 Rev. *E CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 Description Ground for the core of the device. Ground for the IO circuitry.
  • Page 8 Doing so will tri-state the output drivers. As a safety precaution, DQ are automatically tri-stated whenever a write cycle is detected, regardless of the state of OE. Document Number: 38-05548 Rev. *E CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 Burst Sequences CY7C1386DV25/CY7C1387DV25/CY7C1386FV25/ CY7C1387FV25 provides a two-bit wraparound counter, fed...
  • Page 9: Truth Table

    9. OE is asynchronous and is not sampled with the clock rise. It is masked internally during write cycles. During a read cycle all data bits are tri-state when OE is inactive or when the device is deselected, and all data bits behave as output when OE is active (LOW). Document Number: 38-05548 Rev. *E CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 Test Conditions ZZ >...
  • Page 10 Partial Truth Table for Read/Write Function (CY7C1386DV25/CY7C1386FV25) Read Read Write Byte A – (DQ and DQP Write Byte B – (DQ and DQP Write Bytes B, A Write Byte C – (DQ and DQP Write Bytes C, A Write Bytes C, B Write Bytes C, B, A Write Byte D –...
  • Page 11 The TMS input is used to give commands to the TAP controller and is sampled on the rising edge of TCK. This pin may be left Document Number: 38-05548 Rev. *E CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 unconnected if the TAP is not used. The ball is pulled up internally, resulting in a logic HIGH level.
  • Page 12 TDI and TDO. During this state, instructions are shifted through the instruction register through the TDI and TDO balls. Document Number: 38-05548 Rev. *E CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 To execute the instruction once it is shifted in, the TAP controller needs to be moved into the Update-IR state.
  • Page 13 (TDI) Test Data-Out (TDO) Document Number: 38-05548 Rev. *E CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 the TAP controller, it will directly control the state of the output (Q-bus) pins, when the EXTEST is entered as the current instruction. When HIGH, it will enable the output buffers to drive the output bus.
  • Page 14 12. Test conditions are specified using the load in TAP AC test conditions. t 13. All voltages referenced to V (GND). Document Number: 38-05548 Rev. *E CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 Description TAP AC Output Load Equivalent to 2.5V...
  • Page 15: Identification Codes

    RESERVED Do Not Use. This instruction is reserved for future use. BYPASS Places the bypass register between TDI and TDO. This operation does not affect SRAM operations. Document Number: 38-05548 Rev. *E CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 CY7C1387DV25/ CY7C1387FV25 01011 01011...
  • Page 16 Ball ID Bit # Notes 14. Balls that are NC (No Connect) are preset LOW. 15. Bit #85 is preset HIGH. Document Number: 38-05548 Rev. *E CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 [14, 15] Ball ID Bit # Ball ID Bit #...
  • Page 17 165-Ball BGA Boundary Scan Order Bit # Ball ID Note 16. Bit #89 is preset HIGH. Document Number: 38-05548 Rev. *E CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 [14, 16] Bit # Ball ID Bit # Ball ID Internal Page 17 of 30...
  • Page 18: Maximum Ratings

    18. T : assumes a linear ramp from 0V to V power up Document Number: 38-05548 Rev. *E CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 DC Input Voltage ... –0.5V to V Current into Outputs (LOW) ... 20 mA Static Discharge Voltage... >2001V (per MIL-STD-883, Method 3015) Latch-up Current ...
  • Page 19: Thermal Resistance

    = 50Ω = 1.25V Note 19. Tested initially and after any design or process change that may affect these parameters. Document Number: 38-05548 Rev. *E CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 100 TQFP Test Conditions Package = 25°C, f = 1 MHz, = 2.5V...
  • Page 20: Switching Characteristics

    These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve High-Z prior to Low-Z under the same system conditions. 25. This parameter is sampled and not 100% tested. Document Number: 38-05548 Rev. *E CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 250 MHz Min.
  • Page 21: Switching Waveforms

    High-Z t CO Single READ Note 26. On this diagram, when CE is LOW, CE is LOW, CE Document Number: 38-05548 Rev. *E CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 t ADH t ADVS t ADVH ADV suspends burst t OEV t CO...
  • Page 22 BURST READ Single WRITE Note 27. Full width write can be initiated by either GW LOW, or by GW HIGH, BWE LOW and BW Document Number: 38-05548 Rev. *E CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 t WES t WEH ADV suspends burst...
  • Page 23 28. The data bus (Q) remains in high-Z following a write cycle, unless a new read access is initiated by ADSP or ADSC. 29. GW is HIGH. Document Number: 38-05548 Rev. *E CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 t WES t WEH...
  • Page 24 30. Device must be deselected when entering ZZ sleep mode. See cycle descriptions table for all possible signal conditions to deselect the device. 31. DQs are in high-Z when exiting ZZ sleep mode. Document Number: 38-05548 Rev. *E CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 High-Z DON’T CARE...
  • Page 25: Ordering Information

    51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) CY7C1387DV25-200BZI CY7C1386DV25-200BZXI 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free CY7C1387DV25-200BZXI Document Number: 38-05548 Rev. *E CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 Part and Package Type Operating Range Commercial...
  • Page 26 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) CY7C1387DV25-250BZI CY7C1386DV25-250BZXI 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free CY7C1387DV25-250BZXI Document Number: 38-05548 Rev. *E CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 Page 26 of 30 Commercial Industrial [+] Feedback...
  • Page 27: Package Diagrams

    0° MIN. 0.20 MAX. 0.25 GAUGE PLANE R 0.08 MIN. 0°-7° 0.20 MAX. 0.60±0.15 0.20 MIN. 1.00 REF. DETAIL Document Number: 38-05548 Rev. *E CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 16.00±0.20 14.00±0.10 0.30±0.08 0.65 TYP. SEATING PLANE STAND-OFF 0.05 MIN. NOTE: 0.15 MAX.
  • Page 28 Package Diagrams (continued) Figure 2. 119-Ball BGA (14 x 22 x 2.4 mm) (51-85115) Document Number: 38-05548 Rev. *E CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 Page 28 of 30 51-85115-*B [+] Feedback...
  • Page 29 The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25 0.15(4X)
  • Page 30 Document History Page Document Title: CY7C1386DV25/CY7C1387DV25/CY7C1386FV25/ CY7C1387FV25 18-Mbit (512K x 36/1M x 18) Pipelined DCD Sync SRAM Document Number: 38-05548 Orig. of REV. ECN NO. Issue Date Change 254550 See ECN 288531 See ECN 326078 See ECN 418125 See ECN...

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