Cypress Semiconductor CY7C1316CV18 Specification Sheet

18-mbit ddr-ii sram 2-word burst architecture

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Features
18-Mbit density (2M x 8, 2M x 9, 1M x 18, 512K x 36)
267 MHz clock for high bandwidth
2-word burst for reducing address bus frequency
Double Data Rate (DDR) interfaces
(data transferred at 534 MHz) at 267 MHz
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
Synchronous internally self-timed writes
DDR-II operates with 1.5 cycle read latency when the DLL is
enabled
Operates similar to a DDR-I device with 1 cycle read latency in
DLL off mode
1.8V core power supply with HSTL inputs and outputs
Variable drive HSTL output buffers
Expanded HSTL output voltage (1.4V–V
Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
JTAG 1149.1 compatible test access port
Delay Lock Loop (DLL) for accurate data placement
Configurations
CY7C1316CV18 – 2M x 8
CY7C1916CV18 – 2M x 9
CY7C1318CV18 – 1M x 18
CY7C1320CV18 – 512K x 36
Selection Guide
Description
Maximum Operating Frequency
Maximum Operating Current
Cypress Semiconductor Corporation
Document Number: 001-07160 Rev. *E
18-Mbit DDR-II SRAM 2-Word

Functional Description

The CY7C1316CV18, CY7C1916CV18, CY7C1318CV18, and
CY7C1320CV18 are 1.8V Synchronous Pipelined SRAMs
equipped with DDR-II architecture. The DDR-II consists of an
SRAM core with advanced synchronous peripheral circuitry and
a one-bit burst counter. Addresses for read and write are latched
on alternate rising edges of the input (K) clock. Write data is
registered on the rising edges of both K and K. Read data is
driven on the rising edges of C and C if provided, or on the rising
edge of K and K if C/C are not provided. Each address location
is associated with two 8-bit words in the case of CY7C1316CV18
and two 9-bit words in the case of CY7C1916CV18 that burst
sequentially into or out of the device. The burst counter always
starts with a '0' internally in the case of CY7C1316CV18 and
CY7C1916CV18. For CY7C1318CV18 and CY7C1320CV18,
the burst counter takes in the least significant bit of the external
address and bursts two 18-bit words (in the case of
CY7C1318CV18) of two 36-bit words (in the case of
CY7C1320CV18) sequentially into or out of the device.
Asynchronous inputs include an output impedance matching
input (ZQ). Synchronous data outputs (Q, sharing the same
physical pins as the data inputs, D) are tightly matched to the two
output echo clocks CQ/CQ, eliminating the need to capture data
separately from each individual DDR SRAM in the system
design. Output data clocks (C/C) enable maximum system
clocking and data synchronization flexibility.
)
DD
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
267 MHz
267
x8
775
x9
780
x18
805
x36
855
198 Champion Court
CY7C1316CV18, CY7C1916CV18
CY7C1318CV18, CY7C1320CV18
Burst Architecture
250 MHz
200 MHz
250
200
705
575
710
580
730
600
775
635
,
San Jose
CA 95134-1709
167 MHz
Unit
167
MHz
490
mA
490
510
540
408-943-2600
Revised June 18, 2008
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Summary of Contents for Cypress Semiconductor CY7C1316CV18

  • Page 1: Functional Description

    C and C if provided, or on the rising edge of K and K if C/C are not provided. Each address location is associated with two 8-bit words in the case of CY7C1316CV18 and two 9-bit words in the case of CY7C1916CV18 that burst sequentially into or out of the device.
  • Page 2 Logic Block Diagram (CY7C1316CV18) (19:0) Address Register Gen. DOFF Control Logic [1:0] Logic Block Diagram (CY7C1916CV18) (19:0) Address Register Gen. DOFF Control Logic Document Number: 001-07160 Rev. *E CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Write Write Output Logic Control Read Data Reg.
  • Page 3 [1:0] Logic Block Diagram (CY7C1320CV18) Burst Logic (18:0) Address (18:1) Register Gen. DOFF Control Logic [3:0] Document Number: 001-07160 Rev. *E CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Write Write Output Logic Control Read Data Reg. Reg. Reg. Reg. Write Write Output Logic Control Read Data Reg.
  • Page 4: Pin Configuration

    Pin Configuration The pin configuration for CY7C1316CV18, CY7C1916CV18, CY7C1318CV18, and CY7C1320CV18 follow. NC/72M DOFF NC/72M DOFF Note 1. NC/36M, NC/72M, NC/144M, and NC/288M are not connected to the die and can be tied to any voltage level. Document Number: 001-07160 Rev. *E...
  • Page 5 Pin Configuration (continued) The pin configuration for CY7C1316CV18, CY7C1916CV18, CY7C1318CV18, and CY7C1320CV18 follow. NC/72M DQ10 DQ11 DQ12 DQ13 DOFF DQ14 DQ15 DQ16 DQ17 NC/144M NC/36M DQ27 DQ18 DQ28 DQ29 DQ19 DQ20 DQ30 DQ21 DQ31 DQ22 DOFF DQ32 DQ23 DQ33 DQ24...
  • Page 6: Pin Definitions

    Synchronous device is organized as 2M x 8 (2 arrays each of 1M x 8) for CY7C1316CV18 and 2M x 9 (2 arrays each of 1M x 9) for CY7C1916CV18, 1M x 18 (2 arrays each of 512K x 18) for CY7C1318CV18, and 512K x 36 (2 arrays each of 256K x 36) for CY7C1320CV18.
  • Page 7 Power Supply Power Supply Inputs to the Core of the Device. Ground Ground for the Device. Power Supply Power Supply Inputs for the Outputs of the Device. Document Number: 001-07160 Rev. *E CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Pin Description Switching Characteristics on page 23.
  • Page 8: Functional Overview

    Functional Overview The CY7C1316CV18, CY7C1916CV18, CY7C1318CV18, and CY7C1320CV18 are synchronous pipelined Burst SRAMs equipped with a DDR interface, which operates with a read latency of one and half cycles when DOFF pin is tied HIGH. When DOFF pin is set LOW or connected to V behaves in DDR-I mode with a read latency of one clock cycle.
  • Page 9: Application Example

    Source CLK# Echo Clock1/Echo Clock#1 Echo Clock2/Echo Clock#2 Document Number: 001-07160 Rev. *E CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 These chips use a Delay Lock Loop (DLL) that is designed to function between 120 MHz and the specified maximum clock = 1.5V. The frequency.
  • Page 10: Truth Table

    4. On CY7C1318CV18 and CY7C1320CV18, “A1” represents address location latched by the devices when transaction was initiated and “A2” represents the addresses sequence in the burst. On CY7C1316CV18 and CY7C1916CV18, “A1” represents A + ‘0’ and “A2” represents A + ‘1’.
  • Page 11 L–H – L–H – L–H – L–H – Document Number: 001-07160 Rev. *E CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 [2, 8] Comments [2, 8] Comments – During the data portion of a write sequence, all four bytes (D the device. L–H During the data portion of a write sequence, all four bytes (D the device.
  • Page 12 TDI pin on the rising edge of TCK. Data is output on the TDO pin on the falling edge of TCK. Document Number: 001-07160 Rev. *E CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Instruction Register Three-bit instructions can be serially loaded into the instruction register.
  • Page 13 TAP into the Shift-DR state. This places the boundary scan register between the TDI and TDO pins. Document Number: 001-07160 Rev. *E CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 PRELOAD places an initial data pattern at the latched parallel outputs of the boundary scan register cells before the selection of another boundary scan test operation.
  • Page 14: Tap Controller State Diagram

    The state diagram for the TAP controller follows. TEST-LOGIC RESET TEST-LOGIC/ IDLE Note 9. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document Number: 001-07160 Rev. *E CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 SELECT DR-SCAN CAPTURE-DR SHIFT-DR EXIT1-DR PAUSE-DR...
  • Page 15 10. These characteristics pertain to the TAP inputs (TMS, TCK, TDI and TDO). Parallel load levels are specified in the 11. Overshoot: V (AC) < V + 0.85V (Pulse width less than t 12. All Voltage referenced to Ground. Document Number: 001-07160 Rev. *E CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Bypass Register Instruction Register Identification Register Boundary Scan Register...
  • Page 16 14. Test conditions are specified using the load in TAP AC Test Conditions. t Document Number: 001-07160 Rev. *E CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Description [14] Figure 2.
  • Page 17: Instruction Codes

    RESERVED Do Not Use: This instruction is reserved for future use. BYPASS Places the bypass register between TDI and TDO. This operation does not affect SRAM operation. Document Number: 001-07160 Rev. *E CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Value CY7C1916CV18 CY7C1318CV18 00000110100...
  • Page 18 Boundary Scan Order Bit # Bump ID Bit # Document Number: 001-07160 Rev. *E CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Bump ID Bit # Bump ID Internal Bit # Bump ID Page 18 of 29 [+] Feedback...
  • Page 19 DLL. Unstable Clock Clock Start (Clock Starts after DOFF Document Number: 001-07160 Rev. *E CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 DLL Constraints ■ DLL uses K clock as its synchronizing input. The input must have low phase jitter, which is specified as t ■...
  • Page 20: Maximum Ratings

    , whichever is larger, V 19. The operation current is calculated with 50% read cycle and 50% write cycle. Document Number: 001-07160 Rev. *E CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Current into Outputs (LOW) ... 20 mA Static Discharge Voltage (MIL-STD-883, M 3015)... >2001V Latch up Current...
  • Page 21 Current AC Electrical Characteristics [11] Over the Operating Range Parameter Description Input HIGH Voltage Input LOW Voltage Document Number: 001-07160 Rev. *E CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Test Conditions Max V 267 MHz (x8) Both Ports Deselected, (x9) ≥ V ≤ V...
  • Page 22: Thermal Resistance

    20. Unless otherwise noted, test conditions assume signal transition time of 2V/ns, timing reference levels of 0.75V, V levels of 0.25V to 1.25V, and output loading of the specified I Document Number: 001-07160 Rev. *E CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Test Conditions = 25°C, f = 1 MHz, V...
  • Page 23: Switching Characteristics

    22. This part has an internal voltage regulator; t POWER 23. For DQ2 data signal on CY7C1916CV18 device, t Document Number: 001-07160 Rev. *E CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 267 MHz Description Min Max Min Max Min Max Min Max [22] –...
  • Page 24 5 pF as in (b) of 26. At any voltage and temperature t is less than t Document Number: 001-07160 Rev. *E CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 267 MHz Description Min Max Min Max Min Max Min Max –...
  • Page 25: Switching Waveforms

    29. In this example, if address A4 = A3, then data Q40 = D30 and Q41 = D31. Write data is forwarded immediately as read results. This note applies to the whole diagram. Document Number: 001-07160 Rev. *E CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18...
  • Page 26: Ordering Information

    CY7C1320CV18-250BZI CY7C1316CV18-250BZXI CY7C1916CV18-250BZXI CY7C1318CV18-250BZXI CY7C1320CV18-250BZXI Document Number: 001-07160 Rev. *E CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Package Diagram Package Type 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
  • Page 27 CY7C1320CV18-167BZI CY7C1316CV18-167BZXI CY7C1916CV18-167BZXI CY7C1318CV18-167BZXI CY7C1320CV18-167BZXI Document Number: 001-07160 Rev. *E CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Package Diagram Package Type 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
  • Page 28: Package Diagram

    Figure 6. 165-Ball FBGA (13 x 15 x 1.4 mm), 51-85180 TOP VIEW PIN 1 CORNER 13.00±0.10 SEATING PLANE Document Number: 001-07160 Rev. *E CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 0.15(4X) BOTTOM VIEW PIN 1 CORNER Ø0.05 M C Ø0.25 M C A B -0.06...
  • Page 29 Document History Page Document Title: CY7C1316CV18/CY7C1916CV18/CY7C1318CV18/CY7C1320CV18, 18-Mbit DDR-II SRAM 2-Word Burst Architecture Document Number: 001-07160 Submission Orig. of Rev. ECN No. Date Change 433284 See ECN 462615 See ECN 503690 See ECN 1523383 See ECN VKN/AESA 2507747 See ECN VKN/PYRS Changed Ambient Temperature with Power Applied from “–10°C to +85°C” to “–55°C...

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