Cypress Semiconductor NoBL CY7C1471V25 Manual

72-mbit (2m x 36/4m x 18/1m x 72) flow-through sram with nobl architecture

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Features
• No Bus Latency™ (NoBL™) architecture eliminates dead
cycles between write and read cycles
• Supports up to 133 MHz bus operations with zero wait states
• Data is transferred on every clock
• Pin compatible and functionally equivalent to ZBT™ devices
• Internally self timed output buffer control to eliminate the
need to use OE
• Registered inputs for flow through operation
• Byte Write capability
• 2.5V/1.8V IO supply (V
DDQ
• Fast clock-to-output times
— 6.5 ns (for 133-MHz device)
• Clock Enable (CEN) pin to enable clock and suspend
operation
• Synchronous self timed writes
• Asynchronous Output Enable (OE)
• CY7C1471V25, CY7C1473V25 available in
JEDEC-standard Pb-free 100-pin TQFP, Pb-free and
non-Pb-free 165-Ball FBGA package. CY7C1475V25
available in Pb-free and non-Pb-free 209-Ball FBGA
package.
• Three Chip Enables (CE
, CE
1
expansion.
• Automatic power down feature available using ZZ mode or
CE deselect.
• IEEE 1149.1 JTAG Boundary Scan compatible
• Burst Capability - linear or interleaved burst order
• Low standby power
Selection Guide
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
Note
1. For best practice recommendations, refer to the Cypress application note
Cypress Semiconductor Corporation
Document #: 38-05287 Rev. *I
72-Mbit (2M x 36/4M x 18/1M x 72)
Flow-Through SRAM with NoBL™ Architecture
)
, CE
) for simple depth
2
3
133 MHz
6.5
305
120
198 Champion Court
Functional Description
The CY7C1471V25, CY7C1473V25, and CY7C1475V25 are
2.5V, 2M x 36/4M x 18/1M x 72 synchronous flow through burst
SRAMs designed specifically to support unlimited true
back-to-back read or write operations without the insertion of
wait states. The CY7C1471V25, CY7C1473V25, and
CY7C1475V25 are equipped with the advanced No Bus
Latency (NoBL) logic required to enable consecutive read or
write operations with data transferred on every clock cycle.
This feature dramatically improves the throughput of data
through the SRAM, especially in systems that require frequent
write-read transitions.
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. The clock input is qualified by
the Clock Enable (CEN) signal, which when deasserted
suspends operation and extends the previous clock cycle.
Maximum access delay from the clock rise is 6.5 ns (133-MHz
device).
Write operations are controlled by two or four Byte Write Select
(BW
) and a Write Enable (WE) input. All writes are conducted
X
with on-chip synchronous self timed write circuitry.
Three synchronous Chip Enables (CE
asynchronous Output Enable (OE) provide easy bank
selection and output tri-state control. To avoid bus contention,
the output drivers are synchronously tri-stated during the data
portion of a write sequence.
100 MHz
8.5
275
120
AN1064, SRAM System
Guidelines.
,
San Jose
CA 95134-1709
CY7C1471V25
CY7C1473V25
CY7C1475V25
[1]
, CE
, CE
) and an
1
2
3
Unit
ns
mA
mA
408-943-2600
Revised July 04, 2007
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Summary of Contents for Cypress Semiconductor NoBL CY7C1471V25

  • Page 1 Flow-Through SRAM with NoBL™ Architecture Features • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles • Supports up to 133 MHz bus operations with zero wait states • Data is transferred on every clock • Pin compatible and functionally equivalent to ZBT™ devices •...
  • Page 2 Logic Block Diagram – CY7C1471V25 (2M x 36) ADDRESS A0, A1, A REGISTER MODE WRITE ADDRESS ADV/LD READ LOGIC SLEEP CONTROL Logic Block Diagram – CY7C1473V25 (4M x 18) ADDRESS A0, A1, A REGISTER MODE WRITE ADDRESS ADV/LD BW A BW B READ LOGIC CONTROL...
  • Page 3 Logic Block Diagram – CY7C1475V25 (1M x 72) ADDRESS A0, A1, A REGISTER 0 MODE WRITE ADDRESS REGISTER 1 ADV/LD AND DATA COHERENCY READ LOGIC Sleep Control Document #: 38-05287 Rev. *I BURST LOGIC ADV/LD WRITE ADDRESS REGISTER 2 MEMORY WRITE ARRAY DRIVERS...
  • Page 4: Pin Configurations

    Pin Configurations BYTE C BYTE D Document #: 38-05287 Rev. *I 100-Pin TQFP Pinout CY7C1471V25 CY7C1471V25 CY7C1473V25 CY7C1475V25 BYTE B BYTE A Page 4 of 32 [+] Feedback...
  • Page 5 Pin Configurations (continued) BYTE B Document #: 38-05287 Rev. *I 100-Pin TQFP Pinout CY7C1473V25 CY7C1471V25 CY7C1473V25 CY7C1475V25 BYTE A Page 5 of 32 [+] Feedback...
  • Page 6 Pin Configurations (continued) 165-Ball FBGA (15 x 17 x 1.4 mm) Pinout NC/576M NC/1G NC/144M MODE NC/576M NC/1G NC/144M MODE Document #: 38-05287 Rev. *I CY7C1471V25 (2M x 36) CY7C1473V25 (4M x 18) CY7C1471V25 CY7C1473V25 CY7C1475V25 ADV/LD NC/288M ADV/LD NC/288M Page 6 of 32 [+] Feedback...
  • Page 7 Pin Configurations (continued) 209-Ball FBGA (14 x 22 x 1.76 mm) Pinout DQPg DQPc DQPd DQPh NC/144M Document #: 38-05287 Rev. *I CY7C1475V25 (1M × 72) ADV/LD NC/576M NC/1G MODE CY7C1471V25 CY7C1473V25 CY7C1475V25 DQPf DQPb DQPa DQPe NC/288M Page 7 of 32 [+] Feedback...
  • Page 8: Pin Definitions

    Pin Definitions Name Input- Address Inputs used to select one of the address locations. Sampled at the rising edge Synchronous of the CLK. A , BW Input- Byte Write Inputs, Active LOW. Qualified with WE to conduct writes to the SRAM. , BW Synchronous Sampled on the rising edge of CLK.
  • Page 9: Functional Overview

    Pin Definitions (continued) Name JTAG serial input Serial data-In to the JTAG circuit. Sampled on the rising edge of TCK. If the JTAG feature Synchronous is not used, this pin can be left floating or connected to V pin is not available on TQFP packages. JTAG serial input Serial data-In to the JTAG circuit.
  • Page 10 Because CY7C1471V25, CY7C1473V25, CY7C1475V25 are common IO devices, data must not be driven into the device while the outputs are active. The OE can be deasserted HIGH before presenting data to the DQs and inputs. This tri-states the output drivers. As a safety precaution, DQs and DQP are automatically tri-stated during the data portion of a write cycle, regardless of the state of OE.
  • Page 11: Truth Table

    Truth Table The truth table for CY7C1471V25, CY7C1473V25, and CY7C1475V25 follows. Address Operation Used Deselect Cycle None Deselect Cycle None Deselect Cycle None Continue Deselect Cycle None Read Cycle External (Begin Burst) Read Cycle Next (Continue Burst) NOP/Dummy Read External (Begin Burst) Dummy Read Next...
  • Page 12 Truth Table for Read/Write The read-write truth table for CY7C1471V25 follows. Function Read Write No bytes written Write Byte A – (DQ and DQP Write Byte B – (DQ and DQP Write Byte C – (DQ and DQP Write Byte D – (DQ and DQP Write All Bytes Truth Table for Read/Write...
  • Page 13 IEEE 1149.1 Serial Boundary Scan (JTAG) The CY7C1471V25, CY7C1473V25, and CY7C1475V25 and incorporate a serial boundary scan test access port (TAP). This port operates in accordance with IEEE Standard 1149.1-1990 but does not have the set of functions required for full 1149.1 compliance. These functions from the IEEE specification are excluded because their inclusion places an added delay in the critical speed path of the SRAM.
  • Page 14 TAP Registers Registers are connected between the TDI and TDO balls and enable data to be scanned into and out of the SRAM test circuitry. Only one register can be selected at a time through the instruction register. Data is serially loaded into the TDI ball on the rising edge of TCK.
  • Page 15 signal while in transition (metastable state). This does not harm the device, but there is no guarantee as to the value that is captured. Repeatable results may not be possible. To guarantee that the boundary scan register captures the correct value of a signal, the SRAM signal must be stabilized long enough to meet the TAP controller’s capture setup plus hold time (t plus t...
  • Page 16 TAP AC Switching Characteristics [10, 11] Over the Operating Range Parameter Clock TCK Clock Cycle Time TCYC TCK Clock Frequency TCK Clock HIGH Time TCK Clock LOW Time Output Times TCK Clock LOW to TDO Valid TDOV TCK Clock LOW to TDO Invalid TDOX Setup Times TMS Setup to TCK Clock Rise...
  • Page 17 1.8V TAP AC Test Conditions Input pulse levels ... 0.2V to V Input rise and fall time... 1 ns Input timing reference levels ...0.9V Output reference levels...0.9V Test load termination supply voltage...0.9V 1.8V TAP AC Output Load Equivalent Z = 50Ω TAP DC Electrical Characteristics And Operating Conditions (0°C <...
  • Page 18: Identification Codes

    Scan Register Sizes Register Name Instruction Bypass Boundary Scan Order – 165FBGA Boundary Scan Order – 209BGA Identification Codes Instruction Code EXTEST IDCODE SAMPLE Z RESERVED SAMPLE/PRELOAD RESERVED RESERVED BYPASS Document #: 38-05287 Rev. *I Bit Size (x36) Bit Size (x18) Description Captures IO ring contents.
  • Page 19 Boundary Scan Exit Order (2M x 36) Bit # 165-Ball ID Bit # Boundary Scan Exit Order (4M x 18) Bit # 165-Ball ID Bit # Document #: 38-05287 Rev. *I 165-Ball ID Bit # 165-Ball ID 165-Ball ID Bit # 165-Ball ID CY7C1471V25 CY7C1473V25...
  • Page 20 Boundary Scan Exit Order (1M x 72) Bit # 209-Ball ID Bit # Document #: 38-05287 Rev. *I 209-Ball ID Bit # 209-Ball ID CY7C1471V25 CY7C1473V25 CY7C1475V25 Bit # 209-Ball ID Page 20 of 32 [+] Feedback...
  • Page 21: Maximum Ratings

    Maximum Ratings Exceeding maximum ratings may impair the useful life of the device. These user guidelines are not tested. Storage Temperature ... –65°C to +150°C Ambient Temperature with Power Applied... –55°C to +125°C Supply Voltage on V Relative to GND... –0.5V to +3.6V Supply Voltage on V Relative to GND ...
  • Page 22: Thermal Resistance

    Capacitance Tested initially and after any design or process change that may affect these parameters. Parameter Description Address Input Capacitance ADDRESS Data Input Capacitance DATA Control Input Capacitance CTRL Clock Input Capacitance Input-Output Capacitance Thermal Resistance Tested initially and after any design or process change that may affect these parameters. Parameter Description Θ...
  • Page 23: Switching Characteristics

    Switching Characteristics Over the Operating Range. Timing reference level is 1.25V when V shown in (a) of “AC Test Loads and Waveforms” on page 22 Parameter POWER Clock Clock Cycle Time Clock HIGH Clock LOW Output Times Data Output Valid After CLK Rise Data Output Hold After CLK Rise Clock to Low-Z Clock to High-Z...
  • Page 24: Switching Waveforms

    Switching Waveforms Figure 1 shows read-write timing waveform. t CYC t CENS t CENH t CL t CH t CES t CEH ADV/LD ADDRESS t AS t AH D(A1) t DS t DH COM M AND W RITE W RITE D(A1) D(A2) D(A2+1)
  • Page 25 Switching Waveforms (continued) Figure 2 shows NOP, STALL and DESELECT Cycles waveform. Figure 2. NOP, STALL and DESELECT Cycles ADV/LD [A:D] ADDRESS D(A1) COMMAND WRITE READ D(A1) Q(A2) Note 22. The IGNORE CLOCK EDGE or STALL cycle (Clock 3) illustrates CEN being used to create a pause. A write is not performed during this cycle. Document #: 38-05287 Rev.
  • Page 26 Switching Waveforms (continued) Figure 3 shows ZZ Mode timing waveform. t ZZI SUPPLY I DDZZ ALL INPUTS (except ZZ) Outputs (Q) Notes 23. Device must be deselected when entering ZZ mode. See 24. DQs are in high-Z when exiting ZZ sleep mode. Document #: 38-05287 Rev.
  • Page 27: Ordering Information

    Ordering Information Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit www.cypress.com for actual products offered. Speed Package (MHz) Ordering Code Diagram CY7C1471V25-133AXC 51-85050 100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Pb-Free CY7C1473V25-133AXC CY7C1471V25-133BZC 51-85165 165-Ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm)
  • Page 28: Package Diagrams

    Package Diagrams Figure 4. 100-Pin Thin Plastic Quad Flatpack (14 x 20 x 1.4 mm), 51-85050 R 0.08 MIN. 0° MIN. 0.20 MAX. 0.25 GAUGE PLANE R 0.08 MIN. 0°-7° 0.20 MAX. 0.60±0.15 0.20 MIN. 1.00 REF. DETAIL Document #: 38-05287 Rev. *I 16.00±0.20 14.00±0.10 0.30±0.08...
  • Page 29 Package Diagrams (continued) Figure 5. 165-Ball FBGA (15 x 17 x 1.4 mm), 51-85165 TOP VIEW PIN 1 CORNER SEATING PLANE Document #: 38-05287 Rev. *I 0.15(4X) CY7C1471V25 CY7C1473V25 CY7C1475V25 PIN 1 CORNER BOTTOM VIEW Ø0.05 M C Ø0.25 M C A B Ø0.45±0.05(165X) 1.00 5.00...
  • Page 30 Package Diagrams (continued) Figure 6. 209-Ball FBGA (14 x 22 x 1.76 mm), 51-85167 NoBL and No Bus Latency are trademarks of Cypress Semiconductor Corporation. ZBT is a trademark of Integrated Device Technology, Inc. All product and company names mentioned in this document are the trademarks of their respective holders. Document #: 38-05287 Rev.
  • Page 31 Document History Page Document Title: CY7C1471V25/CY7C1473V25/CY7C1475V25, 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL™ Architecture Document Number: 38-05287 Issue Orig. of REV. ECN NO. Date Change 114674 08/06/02 121522 01/27/03 223721 See ECN 235012 See ECN 243572 See ECN 299511...
  • Page 32 Document Title: CY7C1471V25/CY7C1473V25/CY7C1475V25, 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL™ Architecture Document Number: 38-05287 Issue Orig. of REV. ECN NO. Date Change 472335 See ECN 1274732 See ECN VKN/AESA Document #: 38-05287 Rev. *I Description of Change Corrected the typo in the pin configuration for 209-Ball FBGA pinout (Corrected the ball name for H9 to V from V...

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